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| 型號： | JAW050A1 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 359K |
| 代理商： | JAW050A1 |
Lucent Technologies Inc.
13
Advance Data Sheet
May 1999
dc-dc Converters; 36 Vdc to 75 Vdc Input, 5 Vdc Output; 50 W to 75 W
JAW050A and JAW075A Power Modules:
Thermal Considerations
(continued)
Heat Transfer with Heat Sinks
(continued)
Solution
Given: V
I
= 55 V
I
O
= 15 A
T
A
= 40
°
C
T
C
= 82
°
C
Heat sink = 1/4 in.
Determine P
D
by using Figure 20:
P
D
= 14 W
Then solve the following equation:
Use Figure 23 to determine air velocity for the 1/4 inch
heat sink.
The minimum airflow necessary for this module is
1.1 m/s (220 ft./min.).
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θ
cs) and
sink-to-ambient (
θ
sa) as shown in Figure 25.
8-1304(C)
Figure 25. Resistance from Case-to-Sink and
Sink-to-Ambient
For a managed interface using thermal grease or foils,
a value of
θ
cs = 0.1
°
C/W to 0.3
°
C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate circuit-board cleaning and drying
can affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to Lucent Technologies Board-
Mounted Power Modules: Soldering and Cleaning
Application Note (AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
refer to the FLTR100V10 Filter ModuleData Sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs. For additional layout guidelines, refer
to the FLTR100V10 Filter ModuleData Sheet (DS98-
152EPS).
θ
ca
C
-T
T
A
–
(
)
P
D
=
θ
ca
-82
40
–
(
)
14
=
θ
ca
3.0
°
C/W
=
P
D
T
C
T
S
T
A
cs
sa
θ
sa
T
-------P
T
(
)
D
θ
cs
–
=
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