參數(shù)資料
型號: K4S1G0732B
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: SDRAM stacked 1Gb B-die
中文描述: 1Gb的乙堆疊內(nèi)存芯片
文件頁數(shù): 7/12頁
文件大小: 126K
代理商: K4S1G0732B
CMOS SDRAM
Rev. 1.1 February 2004
SDRAM stacked 1Gb B-die (x8)
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, T
A
= 0 to 70
°
C)
1. Measured with outputs open.
2. Refresh period is 64ms.
3. K4S1G0732B-TC75
4. Unless otherwise noticed, input swing level is CMOS(V
IH
/V
IL
=V
DDQ
/V
SSQ
).
Notes :
Parameter
Symbol
Test Condition
Version
Unit
Note
-75
Operating current
(One bank active)
I
CC1
Burst length = 1
t
RC
t
RC
(min)
I
O
= 0 mA
110
mA
1
Precharge standby current in
power-down mode
I
CC2
P
CKE
V
IL
(max), t
CC
= 10ns
4
mA
I
CC2
PS
CKE & CLK
V
IL
(max), t
CC
=
4
Precharge standby current in
non power-down mode
I
CC2
N
CKE
V
IH
(min), CS
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during 20ns
40
mA
I
CC2
NS
CKE
V
IH
(min), CLK
V
IL
(max), t
CC
=
Input signals are stable
20
Active standby current in
power-down mode
I
CC3
P
CKE
V
IL
(max), t
CC
= 10ns
8
mA
I
CC3
PS
CKE & CLK
V
IL
(max), t
CC
=
8
Active standby current in
non power-down mode
(One bank active)
I
CC3
N
CKE
V
IH
(min), CS
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during 20ns
50
mA
I
CC3
NS
CKE
V
IH
(min), CLK
V
IL
(max), t
CC
=
Input signals are stable
35
mA
Operating current
(Burst mode)
I
CC4
I
O
= 0 mA
Page burst
4banks Activated
t
CCD
= 2CLKs
130
mA
1
Refresh current
I
CC5
t
RC
t
RC
(min)
220
mA
2
Self refresh current
I
CC6
CKE
0.2V
12
mA
3
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