參數(shù)資料
型號(hào): K7I163682B-FC30
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM
中文描述: 512Kx36位,1Mx18位首席信息官b2條DDRII的SRAM
文件頁(yè)數(shù): 12/17頁(yè)
文件大?。?/td> 378K
代理商: K7I163682B-FC30
512Kx36 & 1Mx18 DDRII CIO b2 SRAM
- 12 -
Rev 3.1
July. 2004
K7I163682B
K7I161882B
APPLICATION INRORMATION
THERMAL RESISTANCE
Note
: Junction temperature is a function of on-chip power dissipation, package thermal impedance, mounting site temperature and mounting site
thermal impedance. T
J
=T
A
+ P
D
x
θ
JA
PRMETER
SYMBOL
TYP
UNIT
°
C
/W
°
C
/W
NOTE
Junction to Ambient
θ
JA
θ
JC
17.1
Junction to Case
3.3
PIN CAPACITANCE
Note
: 1. Parameters are tested with RQ=250
and V
DDQ
=1.5V.
2. Periodically sampled and not 100% tested.
PRMETER
SYMBOL
TESTCONDITION
TYP
MAX
UNIT
NOTE
Address Control Input Capacitance
C
IN
V
IN
=0V
4
5
pF
Input and Output Capacitance
C
OUT
V
OUT
=0V
6
7
pF
Clock Capacitance
C
CLK
-
5
6
pF
SRAM#1
D
SA
R W BW
0
Q
K
CQ
K
C C
SRAM#4
R
Vt
Vt
Vt
R=50
Vt=V
REF
Vt
Vt
R
R=250
BW
1
D
SA
RW BW
0
Q
K
C C
BW
1
K
Data In
Data Out
Address
R
W
BW
Return CLK
Source CLK
Return CLK
Source CLK
MEMORY
CONTROLLER
CQ
ZQ R=250
CQ
CQ
ZQ
SRAM1 Input CQ
SRAM1 Input CQ
SRAM4 Input CQ
SRAM4 Input CQ
相關(guān)PDF資料
PDF描述
K7I643684M-FCI20 72Mb DDRII SRAM Specification
K7I641884M 72Mb DDRII SRAM Specification
K7I641884M-CE25 72Mb DDRII SRAM Specification
K7I641884M-CE30 72Mb DDRII SRAM Specification
K7I641884M-CI25 72Mb DDRII SRAM Specification
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