參數(shù)資料
型號(hào)： K8D1716UTC-DI09
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述： 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
中文描述： 1,600位（200萬x8/1M x16）的雙銀行NOR閃存
文件頁(yè)數(shù)： 11/41頁(yè)
文件大小： 684K
代理商： K8D1716UTC-DI09
FLASH MEMORY
K8D1716UTC / K8D1716UBC
Revision 1.0
December 2004
11
Figure 3. Autoselect Operation ( by command sequence method )
WE
555H/
AAAH
2AAH/
555H
555H/
AAAH
AAH
55H
90H
00H/
00H
01H/
02H
ECH
Manufacturer
Code
Device Code
(K8D1716U)
A19
～
A0(x16)/*
A19
～
A-1(x8)
DQ15
～
DQ0
F0H
Return to
Read Mode
Write (Program/Erase) Mode
The K8D1716U executes its program/erase operations by writing commands into the command register. In order to write the com-
mands to the register, CE and WE must be low and OE must be high. Addresses are latched on the falling edge of CE or WE (which-
ever occurs last) and the data are latched on the rising edge of CE or WE (whichever occurs first). The device uses standard
microprocessor write timing.
Program
The K8D1716U can be programmed in units of a word or a byte. Programming is writing 0's into the memory array by executing the
Internal Program Routine. In order to perform the Internal Program Routine, a four-cycle command sequence is necessary. The first
two cycles are unlock cycles. The third cycle is assigned for the program setup command. In the last cycle, the address of the mem-
ory location and the data to be programmed at that location are written. The device automatically generates adequate program
pulses and verifies the programmed cell margin by the Internal Program Routine. During the execution of the Routine, the system is
not required to provide further controls or timings.
During the Internal Program Routine, commands written to the device will be ignored. Note that a hardware reset during a program
operation will cause data corruption at the corresponding location.
Figure 4. Program Command Sequence
WE
555H/
AAAH
2AAH/
555H
555H/
AAAH
AAH
55H
A0H
Program
Address
Program
Data
Program
Start
DQ15-DQ0
RY/BY
A9
V
ID
00H
01H
ECH
2275H
2277H
Manufacturer
Code
Device Code
(
K8D1716U
)
A6,A1,A0*
DQ15-DQ0
Figure 2. Autoselect Operation ( by high voltage method )
Return to
Read Mode
V = V
IH
or V
IL
22or
2277H
Note :
The addresses other than A0 , A1 and A6 are Don
′
t care. Please refer to Table 9 for device code.
Note :
The 3rd Cycle and 4th Cycle address must include the same bank address. Please refer to Table 9 for device code.
A19
～
A0(x16)/
A19
～
A-1(x8)
相關(guān)PDF資料
PDF描述
K8D1716UTC-FC07 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FC08 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FC09 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FI07 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FI08 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K8D1716UTC-FC07 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FC08 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FC09 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FI07 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
K8D1716UTC-FI08 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*