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參數(shù)資料
| 型號(hào)： | KMM372F213CS |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 2M x 72 DRAM DIMM with ECC using 2Mx8, 2K Refresh, 3.3V |
| 中文描述： | 200萬(wàn)× 72的DRAM內(nèi)存的ECC的使用2Mx8和2K刷新，3.3 |
| 文件頁(yè)數(shù)： | 4/20頁(yè) |
| 文件大?。?/td> | 455K |
| 代理商： | KMM372F213CS |
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DRAM MODULE
KMM372F213CK/CS
CAPACITANCE
(T
A
= 25
°
C, Vcc=3.3V, f = 1MHz)
Item
Symbol
C
IN1
C
IN2
C
IN3
C
IN4
C
DQ1
Min
Max
20
20
45
20
20
Unit
pF
pF
pF
pF
pF
Input capacitance[A0-A10, B0]
Input capacitance[W0, W2, OE0, OE2]
Input capacitance[RAS0, RAS2]
Input capacitance[CAS0, CAS4]
Input/Output capacitance[DQ0 - 71]
-
-
-
-
-
AC CHARACTERISTICS
(0
°
C
≤
T
A
≤
70
°
C, V
CC
=3.3V
±
0.3V. See notes 1,2.)
Test condition : V
ih
/V
il
=2.0/0.8V, V
oh
/V
ol
=2.0/0.8V, Output loading CL=100pF
Parameter
Symbol
-5
-6
Unit
Note
Min
84
131
Max
Min
104
155
Max
Random read or write cycle time
Read-modify-write cycle time
Access time from RAS
Access time from CAS
Access time from column address
CAS to output in Low-Z
OE to output in Low-Z
Output buffer turn-off delay from CAS
Transition time(rise and fall)
RAS precharge time
RAS pulse width
RAS hold time
CAS hold time
CAS pulse width
RAS to CAS delay time
RAS to column address delay time
CAS to RAS precharge time
Row address set-up time
Row address hold time
Column address set-up time
Column address hold time
Column address to RAS lead time
Read command set-up time
Read command hold time referenced to CAS
Read command hold time referenced to RAS
Write command hold time
Write command pulse width
Write command to RAS lead time
Write command to CAS lead time
Data set-up time
Data hold time
Refresh period(2K Ref.)
Write command set-up time
CAS to W delay time
RAS to W delay time
t
RC
t
RWC
t
RAC
t
CAC
t
AA
t
CLZ
t
OLZ
t
CEZ
t
T
t
RP
t
RAS
t
RSH
t
CSH
t
CAS
t
RCD
t
RAD
t
CRP
t
ASR
t
RAH
t
ASC
t
CAH
t
RAL
t
RCS
t
RCH
t
RRH
t
WCH
t
WP
t
RWL
t
CWL
t
DS
t
DH
t
REF
t
WCS
t
CWD
t
RWD
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ns
ns
ns
50
18
30
60
20
35
3,4,10
3,4,5,14
3,10,14
3,14
3,14
6,11,12,14
2
8
8
8
2
30
50
18
36
8
18
13
10
5
8
0
8
30
0
0
-2
10
10
18
8
-2
13
8
8
8
2
40
60
20
43
10
18
13
10
5
8
0
10
35
0
0
-2
10
10
20
10
-2
15
18
50
20
50
10K
10K
14
14
13
4,14
10,14
14
14
14
10K
32
20
10K
40
25
14
8
8,14
14
9,14
9,14
32
32
0
36
71
0
40
83
7
7
7,14
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| KMM372F3200BK3 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V |
| KMM372F3200BS1 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V |
| KMM372F3200CS1 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V |
| KMM372F3280BK3 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V |
| KMM372F3280BS1 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V |
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