參數(shù)資料
型號: KMPC8544EAVTANG
廠商: Freescale Semiconductor
文件頁數(shù): 117/117頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC III 783-PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 800MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
99
Thermal
20.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8544E implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 20.3.4, “Temperature Diode,for more
information.
The recommended attachment method to the heat sink is illustrated in Figure 61. The heat sink should be
attached to the printed-circuit board with the spring force centered over the die. This spring force should
not exceed 10 pounds force (45 Newton).
Figure 61. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech 408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Thermal Interface Material
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
Adhesive or
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