參數(shù)資料
型號(hào): KMPC880ZP133
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 2/87頁(yè)
文件大小: 0K
描述: IC MPU POWERQUICC 133MHZ 357PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 133MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤
MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
10
Freescale Semiconductor
Thermal Characteristics
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or VDD).
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC885/MPC880.
Table 3. Operating Temperatures
Rating
Symbol
Value
Unit
Temperature1 (standard)
1 Minimum temperatures are guaranteed as ambient temperature, T
A. Maximum
temperatures are guaranteed as junction temperature, TJ.
TA(min)
0°C
TJ(max)
95
°C
Temperature (extended)
TA(min)
–40
°C
TJ(max)
100
°C
Table 4. MPC885/MPC880 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
37
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
25
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
30
Four-layer board (2s2p)
RθJMA
22
Junction-to-board4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
——
RθJB
17
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
——
RθJC
10
Junction-to-package top6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Natural convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
相關(guān)PDF資料
PDF描述
IDT7006L25G IC SRAM 128KBIT 25NS 68PGA
IDT7006L20G IC SRAM 128KBIT 20NS 68PGA
IDT7006L17G IC SRAM 128KBIT 17NS 68PGA
KMPC880CZP133 IC MPU POWERQUICC 133MHZ 357PBGA
IDT70V07S35G IC SRAM 256KBIT 35NS 68PGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC880ZP66 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Hardware Specifications
KMPC880ZP80 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC885 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Hardware Specifications
KMPC885CVR133 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC885CVR66 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324