參數(shù)資料
型號(hào)： L640GU73VI
廠商： Advanced Micro Devices, Inc.
英文描述： 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O⑩ Control
中文描述： 64兆位（4個(gè)M x 16位）的CMOS 3.0伏特，只有統(tǒng)一閃存部門與VersatileI /輸出⑩控制
文件頁(yè)數(shù)： 5/55頁(yè)
文件大?。?/td> 719K
代理商： L640GU73VI
June 14, 2005
Am29LV641G
6
A D V A N C E I N F O R M A T I O N
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Special Package Handling Instructions ....................................7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .10
Table 1. Device Bus Operations .....................................................10
VersatileI/O
(V
IO
) Control ....................................................10
Requirements for Reading Array Data ...................................10
Writing Commands/Command Sequences ............................11
Accelerated ProgramOperation ......................................................11
Autoselect Functions .......................................................................11
Standby Mode ........................................................................11
Automatic Sleep Mode ...........................................................11
RESET#: Hardware Reset Pin ...............................................11
Output Disable Mode ..............................................................12
Table 2. Sector Address Table ........................................................12
Autoselect Mode .....................................................................16
Table 3. Autoselect Codes, (High Voltage Method) ......................16
Sector Group Protection and Unprotection .............................17
Table 4. Sector Group Protection/Unprotection Address Table .....17
Write Protect (WP#) ................................................................18
Temporary Sector Group Unprotect .......................................18
Figure 1. Temporary Sector Group UnprotectOperation................ 18
Figure 2. In-SystemSector Group Protect/UnprotectAlgorithms... 19
SecSi
(Secured Silicon) Sector Flash MemoryRegion .......20
Table 5. SecSi Sector Contents ......................................................20
Figure 3. SecSi Sector Protect Verify.............................................. 21
Hardware Data Protection ......................................................21
Low V
CC
Write Inhibit .......................................................................21
Write Pulse “Glitch” Protection ........................................................21
Logical Inhibit ..................................................................................21
Power-Up Write Inhibit ....................................................................21
Common Flash Memory Interface (CFI). . . . . . . 21
Table 6. CFI Query Identification String.......................................... 22
Table 7. SystemInterface String..................................................... 22
Table 8. Device Geometry Definition.............................................. 22
Table 9. Primary Vendor-Specific Extended Query........................ 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................24
Reset Command .....................................................................25
Autoselect Command Sequence ............................................25
Enter SecSi Sector/Exit SecSi Sector CommandSequence ..25
Word ProgramCommand Sequence .....................................25
Unlock Bypass Command Sequence ..............................................26
Figure 4. ProgramOperation.......................................................... 26
Chip Erase Command Sequence ...........................................26
Sector Erase Command Sequence ........................................27
Erase Suspend/Erase Resume Commands ...........................27
Figure 5. Erase Operation............................................................... 28
Command Definitions .............................................................29
Table 10. Command Definitions...................................................... 29
Write Operation Status . . . . . . . . . . . . . . . . . . . . .30
DQ7: Data#Polling .................................................................30
Figure 6. Data#Polling Algorithm.................................................. 30
DQ6: Toggle Bit I ....................................................................30
Figure 7. Toggle Bit Algorithm........................................................ 31
DQ2: Toggle Bit II ...................................................................32
Reading Toggle Bits DQ6/DQ2 ...............................................32
DQ5: Exceeded Timng Limts ................................................32
DQ3: Sector Erase Timer .......................................................32
Table 11. Write Operation Status ...................................................33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 8. MaximumNegative OvershootWaveform..................... 34
Figure 9. MaximumPositive OvershootWaveform....................... 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 10. I
CC1
Current vs. Time (Showing
ActiveandAutomaticSleepCurrents)........................................... 36
Figure 11. Typical I
vs. Frequency............................................ 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 12. Test Setup.................................................................... 37
Table 12. Test Specifications .........................................................37
Key to Switching Waveforms. . . . . . . . . . . . . . . . 37
Figure 13. Input Waveforms and
Measurement Levels...................................................................... 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Read-Only Operations ...........................................................38
Figure 14. Read Operation Timngs............................................... 38
Hardware Reset (RESET#) ....................................................39
Figure 15. Reset Timngs............................................................... 39
Erase and ProgramOperations ..............................................40
Figure 16. ProgramOperation Timngs.......................................... 41
Figure 17. Accelerated ProgramTimng Diagram.......................... 41
Figure 18. Chip/Sector Erase Operation Timngs.......................... 42
Figure 19. Data# Polling Timngs
(During Embedded Algorithms)...................................................... 43
Figure 20. Toggle Bit Timngs
(During Embedded Algorithms)...................................................... 44
Figure 21. DQ2 vs. DQ6................................................................. 44
Temporary Sector Unprotect ..................................................45
Figure 22. Temporary Sector Group Unprotect TimngDiagram... 45
Figure 23. Sector Group Protect and Unprotect TimngDiagram.. 46
Alternate CE#Controlled Erase and ProgramOperations .....47
Figure 24. Alternate CE#Controlled Write
(Erase/Program OperationTimngs.............................................. 48
Erase And Programming Performance . . . . . . . 49
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
TSOP & FBGA Pin Capacitance. . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
FBE063—63-Ball Fine-Pitch Ball Grid Array
(FBGA) 11x12mmpackage .................................................50
LAA064–64-Ball Fortified Ball Grid Array (Fortified BGA) 13 x 11
mmpackage ...........................................................................51
TS 048—48-Pin Standard TSOP ............................................52
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53
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