參數(shù)資料
型號(hào)： L8567-44PLCC
英文描述： Telecommunication IC
中文描述： 通信集成電路
文件頁(yè)數(shù)： 36/42頁(yè)
文件大?。?/td> 701K
代理商： L8567-44PLCC
36
Lucent Technologies Inc.
Data Sheet
August 1999
People’s Republic of China Applications
L8567 SLIC for
dc Applications
(continued)
Ring Trip Detection
The ring trip circuit is a comparator that has a special input section optimized for this application. The equivalent
circuit is shown in Figure 28, along with its use in an application using unbalanced, battery-backed ringing.
12-3014 (F)
Figure 28. Ring Trip Equivalent Circuit and Equivalent Application
+
–
R
TSP
R
LOOP
15 k
7 V
I
P
= I
N
R
TSN
R
TS2
2 M
2 M
C
RTS1
0.022 μF
C
RTS2
0.27 μF
274 k
PHONE HOOK
SWITCH
RC PHONE
V
BAT
NRDET
R
TS1
402
RTSP
I
N
RTSN
–
+
V
RING
The comparator input voltage compliance is V
CC
to
V
BAT
, and the maximum current is 240 μA in either
direction. Its application is straightforward. A resistance
(R
TSN
+ R
TS2
) in series with the R
TSN
input establishes a
current that is repeated in the R
TSP
input. A slightly
lower resistance (R
TSP
) is placed in series with the R
TSP
input. When ringing is being injected, no dc current
flows through R
TS1
, and so the R
TSP
input is at a lower
potential than R
TSN
. When enough dc loop current
flows, the R
TSP
input voltage increases to trip the com-
parator. In Figure 28, a low-pass filter with a double
The following example illustrates how the detection cir-
cuit of Figure 28 will trip at 12.5 mA dc loop current
using a –48 V battery.
= 17.9 μA
The current I
N
is repeated as I
P
in the positive compar-
ator input. The voltage at comparator input R
TSP
is:
V
RTSP
= V
BAT
+ I
LOOP(dc)
x R
TS1
+ I
P
x R
TSP
Using this equation and the values in the example, the
voltage at input R
TSP
is –12 V during ringing injection
(I
LOOP(dc)
= 0). Input R
TSP
is, therefore, at a level of 5 V
below R
TSN
. When enough dc loop current flows
through R
TS1
to raise its dc drop to 5 V, the comparator
will trip. In this example,
= 12.5 mA
Other Supervision Functions
The L8567 has on-chip thermal shutdown circuitry. If
the silicon die temperature exceeds a nominal
165
°
C temperature, the SLIC will sense this tempera-
ture and enter the thermal shutdown mode, regardless
of the logic inputs. The thermal shutdown mode is func-
tionally similar to the disconnect state. When the die
temperature cools, the SLIC will return to the reshut-
down state. A hysteresis is included in the thermal
shutdown mechanism.
The L8567 also has a logic input pin, NEXTSD, whose
status is transferred to the serial output data bus. This
pin may be connected to an external monitoring device.
An example is the thermal shutdown output pin of the
L7583. If the L7583 enters the thermal shutdown
mode, this is reflected in the TSD output pin of this
device. The L8567 SLIC can accept this status pin and
transfer the information on this pin to the serial output
data bus.
I
N
–7 V – (–48 V)
2.289 M
--------------------------------------
=
I
LOOP dc
)
402
--5 V
=
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