
LB A673, LT A673
2006-10-16
11
Empfohlenes Ltpaddesign
8)
Seite 16
Recommended Solder Pad
8) page 16
Wellenlten (TTW)
TTW Soldering
Empfohlenes Ltpaddesign
8)
Seite 16
Recommended Solder Pad
8) page 16
IR Reflow Lten
IR Reflow Soldering
OHPY1302
4.2 (0.165)
4
1.7 (0.067)
Solder resist
Padgeometrie für
verbesserte Wrmeableitung
Paddesign for
improved heat dissipation
Pick up Area
Ltstopplack
Cu Flche
Cu-area
> 16 mm per pad
2
3.7 (0.146)
1.2 (0.047)
3
Cu-area > 16 mm
Cu-Flche > 16 mm
Paddesign
for improved
heat dissipation
Wrmeableitung
für verbesserte
Padgeometrie
Ltstopplack
Solder resist
OHLPY965
2
2