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參數(shù)資料
| 型號(hào)： | LC0408FC3.3C |
| 英文描述： | Direct ProTek Replacement:LC0408FC3.3C |
| 中文描述： | 直接太克替代：LC0408FC3.3C |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大?。?/td> | 139K |
| 代理商： | LC0408FC3.3C |
3
www.protekdevices.com
05139.R3 11/02
LC0402FC3.3C
thru
LC0402FC24C
GRAPHS
ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0402FC05C
5
0
10
20
30
40
LC0402FC05C
0 5 10 15 20
V
C
0
4
8
12
14
10
6
2
I
PP
- Peak Pulse Current - Amps
FIGURE 4
REFLOW SOLDER PROFILE
225°C
5-10 sec
Instantaneous
to 200°C
Soldering
Time
Cool Down
Time
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Pre-Heat
Time
100°C
200°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
0 25 50 75 100 125 150
T
L
- Lead Temperature - °C
20
40
60
80
100
%
Peak Pulse Power
8/20μs
Average Power
FIGURE 3
POWER DERATING CURVE
0
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