- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄19599 > LC5768VG-5F484C (Lattice Semiconductor Corporation)IC XPLD 768MC 5NS 484FPBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | LC5768VG-5F484C |
| 廠商： | Lattice Semiconductor Corporation |
| 文件頁數(shù)： | 18/99頁 |
| 文件大小： | 0K |
| 描述： | IC XPLD 768MC 5NS 484FPBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | ispMACH™ 5000VG |
| 可編程類型： | 系統(tǒng)內(nèi)可編程 |
| 最大延遲時(shí)間 tpd(1)： | 5.0ns |
| 電壓電源 - 內(nèi)部： | 3 V ~ 3.6 V |
| 邏輯元件/邏輯塊數(shù)目： | 24 |
| 宏單元數(shù)： | 768 |
| 輸入/輸出數(shù)： | 304 |
| 工作溫度： | 0°C ~ 90°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 484-BBGA |
| 供應(yīng)商設(shè)備封裝： | 484-FPBGA（23x23） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁當(dāng)前第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁
Lattice Semiconductor
ispXPLD 5000MX Family Data Sheet
21
sysCONFIG Interface
In addition to being able to program the device through the IEEE 1532 interface a microprocessor style interface
(sysCONFIG interface) allows reconfiguration of the SRAM bits within the device. For more information on the sys-
CONFIG capability, refer to TN1026, ispXP Configuration Usage Guidelines.
Security Scheme
A programmable security scheme is provided on the ispXPLD 5000MX devices as a deterrent to unauthorized
copying of the array configuration patterns. Once programmed, this bit prevents readback of the programmed pat-
tern by a device programmer, securing proprietary designs from competitors. The security bit also prevents pro-
gramming and verification. The entire device must be erased in order to erase the security bit.
Low Power Consumption
The ispXPLD 5000MX devices use zero power non-volatile cells along with full CMOS design to provide low static
power consumption. The 1.8V core reduces dynamic power consumption compared with devices with higher core
voltages. For information on estimating power consumption, refer to TN1031 Power Estimation in ispXPLD 5000MX
Density Migration
The ispXPLD 5000MX family has been designed to ensure that different density devices in the same package have
compatible pin-outs. Furthermore, the architecture ensures a high success rate when performing design migration
from lower density parts to higher density parts. In many cases, it is possible to shift a lower utilization design tar-
geted for a high-density device to a lower density device. However, the exact details of the final resource utilization
will impact the likely success in each case.
IEEE 1149.1-Compliant Boundary Scan Testability
All ispXPLD 5000MX devices have boundary scan cells and are compliant to the IEEE 1149.1 standard. This
allows functional testing of the circuit board on which the device is mounted through a serial scan path that can
access all critical logic notes. Internal boundary scan registers are linked internally, allowing test data to be shifted
in and loaded directly onto test nodes, or test node data to be captured and shifted out for verification. In addition,
these devices can be linked into a board-level serial scan path for board-level testing. The test access port has its
own supply voltage and can operate with LVCMOS3.3, 2.5 and 1.8V standards.
sysIO Quick Configuration
To facilitate the most efficient board test, the physical nature of the I/O cells must be set before running any continu-
ity tests. As these tests are fast, by nature, the overhead and time that is required for configuration of the I/Os’
physical nature should be minimal so that board test time is minimized. The ispXPLD 5000MX family of devices
allows this by offering the user the ability to quickly configure the physical nature of the sysIO cells. This quick con-
figuration takes milliseconds to complete, whereas it takes seconds for the entire device to be programmed. Lat-
tice’s ispVM System programming software can either perform the quick configuration through the PC parallel
port, or can generate the ATE or test vectors necessary for a third-party test system.
SELECT
DEVICES
DISCONTINUED
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| VI-2TV-CY-F3 | CONVERTER MOD DC/DC 5.8V 50W |
| VI-2TV-CY-F1 | CONVERTER MOD DC/DC 5.8V 50W |
| RCM10DRSD-S288 | CONN EDGECARD 20POS .156 EXTEND |
| VI-2TT-CY-F4 | CONVERTER MOD DC/DC 6.5V 50W |
| RSA40DRMH | CONN EDGECARD 80POS .125 SQ WW |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LC5768VG-5FN484C | 制造商:Lattice Semiconductor Corporation 功能描述:CPLD ispMACH 5000VG Family 768 Macro Cells 178.6MHz 3.3V 484-Pin FBGA |
| LC5768VG-75F256C | 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲(chǔ)類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100 |
| LC5768VG-75F256I | 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲(chǔ)類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100 |
| LC5768VG-75F484C | 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲(chǔ)類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100 |
| LC5768VG-75F484I | 功能描述:CPLD - 復(fù)雜可編程邏輯器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存儲(chǔ)類型:EEPROM 大電池?cái)?shù)量:128 最大工作頻率:333 MHz 延遲時(shí)間:2.7 ns 可編程輸入/輸出端數(shù)量:64 工作電源電壓:3.3 V 最大工作溫度:+ 90 C 最小工作溫度:0 C 封裝 / 箱體:TQFP-100 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。