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參數(shù)資料
| 型號(hào)： | LD6805K |
| 廠(chǎng)商： | NXP Semiconductors N.V. |
| 元件分類(lèi)： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Low-dropout regulators, low noise, 150 mA |
| 封裝： | LD6805K/22P<SOT1194|<<<1<Always Pb-free,;LD6805K/12H<SOT1194|<<<1<Always Pb-free,;LD6805K/14H<SOT1194|<<<1<Always Pb-free,;LD6805K/20H<SOT1194|<<& |
| 文件頁(yè)數(shù)： | 13/19頁(yè) |
| 文件大?。?/td> | 573K |
| 代理商： | LD6805K |
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LD6805_SER
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Objective data sheet
Rev. 1 — 22 September 2011
13 of 19
NXP Semiconductors
LD6805 series
Low-dropout regulators, low noise, 150 mA
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 10
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
and
11
Table 10.
Package thickness (mm)
Table 11.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 10
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LD6805K/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 150MA 4HUSON |
| LD6805K/12H,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類(lèi)型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6805K/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 150MA 4HUSON 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 150MA, 4HUSON 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 150MA, 4HUSON; Primary Input Voltage:5.5V; Output Voltage Fixed:1.2V; Dropout Voltage Vdo:250mV; Voltage Regulator Case Style:SOT-1194-1; No. of Pins:4; Output Current:150mA; Operating Temperature Min:-40C; Operating ;RoHS Compliant: Yes |
| LD6805K/12P,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類(lèi)型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6805K/12P115 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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