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參數(shù)資料
| 型號： | LE57D111TC |
| 英文描述： | Telecommunication IC |
| 中文描述： | 通信集成電路 |
| 文件頁數(shù)： | 7/22頁 |
| 文件大?。?/td> | 546K |
| 代理商： | LE57D111TC |
P R E L I M I N A R Y
Le57D11 Data Sheet
7
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Stresses greater than those listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to absolute maximum ratings for extended periods can affect device reliability
Note:
1.
Thermal limiting circuitry on-chip will shut down the circuit at a junction temperature of about 165
o
C. The device should never see this
temperature, and operation above 145
o
C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for
more information.
2.
Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits
is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
Operating Ranges
Legerity guarantees the performance of this device over commercial (0
°
to 70
°
C) and industrial (
40
°
to 85
°
C) temperature
ranges by conducting electrical characterization over each range, and by conducting a production test with single insertion
coupled to periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore TR-TSY-000357
Component Reliability Assurance Requirements for Telecommunications Equipment.
Storage temperature
V
CC
with respect to AGND
V
BAT
with respect to AGND:
Continuous
10 ms
BGND
1
, BGND
2
with respect to AGND
A
1
(TIP), A
2
(TIP), B
1
(RING), B
2
(RING) to
BGND:
Continuous
10 ms (F = 0.1 Hz)
1 μs (F = 0.1 Hz)
250 ns (F = 0.1 Hz)
Current from A
1
(TIP), A
2
(TIP), B
1
(RING), B
2
(RING)
DB
1
, DB
2
, and DAC inputs:
Voltage on ring-trip inputs
Current into ring-trip inputs
C1
1
, C2
1
, C1
2
, C2
2
, CFLT
1
, CFLT
2
Input Voltage
Maximum power dissipation, continuous:
T
A
= 70o C, No heat sink (see note)
In 32-pin PLCC package
In 44-pin eTQFP
Thermal Data (Junction to Ambient):
In 32-pin PLCC package
In 44-pin eTQFP
Thermal Data (Junction to Case):
In 32-pin PLCC package
In 44-pin eTQFP
ESD immunity/pin (Human Body Model)
ESD immunity/pin (Charge Device Model)
–55 to +150o C
–0.4 to +7.0 V
+0.4 to –70 V
+0.4 to –75 V
+3 to –3 V
V
BAT
to + 1 V
–70 to +5 V
–80 to +8 V
–90 to +12 V
±150 mA
V
BAT
to 0 V
±10 mA
–0.4 to V
CC
+ 0.4 V
1.7 W
3.3 W
θ
JA
43o C/W typ
22.7o C/W typ
θ
JC
16o C/W typ
9.2o C/W typ
1.5 kV
1 kV
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