Figure 2-34. LatticeECP/EC Banks LatticeECP/EC devices contain two types of sysI/O buffer pai" />
參數(shù)資料
型號(hào): LFEC1E-3TN144I
廠商: Lattice Semiconductor Corporation
文件頁(yè)數(shù): 90/163頁(yè)
文件大小: 0K
描述: IC FPGA 1.5KLUTS 97I/O 144-TQFP
標(biāo)準(zhǔn)包裝: 60
系列: EC
邏輯元件/單元數(shù): 1500
RAM 位總計(jì): 18432
輸入/輸出數(shù): 97
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 144-LQFP
供應(yīng)商設(shè)備封裝: 144-TQFP(20x20)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)當(dāng)前第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)
2-29
Architecture
LatticeECP/EC Family Data Sheet
Figure 2-34. LatticeECP/EC Banks
LatticeECP/EC devices contain two types of sysI/O buffer pairs.
1.
Top and Bottom sysI/O Buffer Pairs (Single-Ended Outputs Only)
The sysI/O buffer pairs in the top and bottom banks of the device consist of two single-ended output drivers
and two sets of single-ended input buffers (both ratioed and referenced). The referenced input buffer can also
be configured as a differential input.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
Only the I/Os on the top and bottom banks have programmable PCI clamps. These I/O banks also support hot
socketing with IDK less than 1mA. Note that the PCI clamp is enabled after VCC, VCCAUX and VCCIO are at valid
operating levels and the device has been configured.
2.
Left and Right sysI/O Buffer Pairs (Differential and Single-Ended Outputs)
The sysI/O buffer pairs in the left and right banks of the device consist of two single-ended output drivers, two
sets of single-ended input buffers (both ratioed and referenced) and one differential output driver. The refer-
enced input buffer can also be configured as a differential input. In these banks the two pads in the pair are
described as “true” and “comp”, where the true pad is associated with the positive side of the differential I/O,
and the comp (complementary) pad is associated with the negative side of the differential I/O.
Only the left and right banks have LVDS differential output drivers. See the IDK specification for I/O leakage cur-
rent during power-up.
V
REF1(2)
GND
Bank
2
V
CCIO2
V
REF2(2)
V
REF1(3)
GND
Bank
3
V
CCIO3
V
REF2(3)
V
REF1(7)
GND
TOP
LEFT
RIGHT
BOTTOM
Bank
7
V
CCIO7
V
REF2(7)
V
REF1(6)
GND
Bank
6
V
CCIO6
V
REF2(6)
V
REF1(5)
GND
Bank 5
V
CCIO5
V
REF2(5)
V
REF1(4)
GND
Bank 4
V
CCIO4
V
REF2(4)
V
REF1(0)
GND
Bank 0
V
CCIO0
V
REF2(0)
V
REF1(1)
GND
Bank 1
V
CCIO1
V
REF2(1)
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