參數(shù)資料
型號： LFEC3E-3TN100I
廠商： Lattice Semiconductor Corporation
文件頁數(shù)： 70/163頁
文件大?。?/td> 0K
描述： IC FPGA 3.1KLUTS 100TQFP
標(biāo)準(zhǔn)包裝： 90
系列： EC
邏輯元件/單元數(shù)： 3100
RAM 位總計： 56320
輸入/輸出數(shù)： 67
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 100-LQFP
供應(yīng)商設(shè)備封裝： 100-TQFP（14x14）
September 2012
Data Sheet DS1000
2012 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
7-1
Revision History
Date
Version
Section
Change Summary
June 2004
01.0
—
Initial release.
August 2004
01.1
Introduction
Added new device LFECP/LFEC33 in Table 1-1.
Architecture
Added New device LFECP/LFEC33 in Tables 2-9, 2-10 and 2-11.
DC & Switching
Characteristics
Added New device LFECP/LFEC33 on Supply current (Standby) tables.
Added New device LFECP/LFEC33 on Initialization Supply current
tables.
Ordering Information
Added 33K Logic Capacity Device in Part Number Description section.
Added EC33, ECP33 device: Industrial and Commercial to Part Number
table.
Corrected I/O counts in the part number tables for 100/144 TQFP and
208 PQFP packages to match Table 1-1 on page 1.
November 2004
01.3
Introduction
Changed DDR333 (166MHz) to DDR400 (200MHz)
Added “RSDS” offering to the Features list: Flexible I/O Buffer
Architecture
Added information about Secondary Clock Sources
Added information about DCS
Added a section on “Recommended Power-up Sequence”
Updated Figure 2-24 “DQS Routing”
Added DSP Block performance numbers to Table 2-11
Added another row for RSDS in Table 2-13 and Table 2-14
DC & Switching
Characteristics
Updated new timing numbers
Added numbers to derating table
Added DC conditions to RSDS table
Changed LVDS Max. VCCIO to 2.625
Added a row for RSDS in “Operating Condition” table
Updated standby and initialization current table
Added figure 3-12: sysConfig SPI port sequence
Added DDR Timing Table and DDR Timings Figure 3-6
Pinout Information
Added LFECP/EC6 to Pin Information
Added LFECP/EC6 to Power Supply and NC Connections
Added LFECP/EC6 144 TQFP Logic Signal Connections
Added LFECP/EC6 208 PQFP Logic Signal Connections
Added LFECP/EC6 256 fpBGA Logic Signal Connections
Added LFECP/EC6 484 fpBGA Logic Signal Connections
Ordering Information
Added 33K Logic Capacity Device in Part Number Description section.
Added Part Number table for Commercial EC33.
Added Part Number table for Commercial ECP33.
Added Part Number table for Industrial EC33.
Added Part Number table for Industrial ECP33.
LatticeECP/EC Family Data Sheet
Revision History
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFEC3E-3TN144C 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs Pb-Free RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-3TN144I 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs 97 IO 1.2V -3 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-4F256C 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-4F256CES 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1 LUT 160 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-4F256I 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs 1.2V -4 Sp d I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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