Data Sheet
June 1999
LG1625AXF Laser Driver
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
Copyright 1999 Lucent Technologies Inc.
All Rights Reserved
June 1999
DS99-187HSPL
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, FAX 610-712-4106 (In CANADA:
1-800-553-2448
, FAX 610-712-4106)
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Tel. (65) 778 8833
, FAX (65) 777 7495
CHINA:
Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai
200233 P R. China
Tel. (86) 21 6440 0468
,
ext. 316
, FAX (86) 21 6440 0652
JAPAN:
Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1600
, FAX (81) 3 5421 1700
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Data Requests: MICROELECTRONICS GROUP DATALINE:
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Appendix
(continued)
Instructions for Use of Test Fixture
(continued)
5. Insert the package into the pressure ring (lid down) with pin 1 located next to the orientation mark and turn on
the vacuum. The vacuum will retain the package in the pressure ring during the following steps.
6. Align the vertically conductive material on the circuit board.
7. Place the pressure ring down over the alignment pins and gently tighten the thumb screws.
8. Remove vacuum, if desired.
Note: Pressure ring not shown.
5-7874(F)
Figure 11. TF1006A Connector Assignment
DATA IN
(OPTIONAL) V
SS1
NC
GND
MK
MK
GND
(OPTIONAL) V
SS1
V
SS1
(OPTIONAL)
GND
V
TH
V
SS1
V
MOD
V
SS3
V
SS2
V
PRE
GND
OUTPUT
LW5