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參數(shù)資料
| 型號： | LL245A |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 3.3-V ABT 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 的3.3V ABT生根粉16位總線收發(fā)3態(tài)輸出 |
| 文件頁數(shù)： | 8/18頁 |
| 文件大?。?/td> | 477K |
| 代理商： | LL245A |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
CFP
CFP
TSSOP
Package
Drawing
WD
WD
DGG
Pins Package
Qty
1
1
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9668601QXA
5962-9668601VXA
74LVTH16245ADGGRE4
ACTIVE
ACTIVE
ACTIVE
48
48
48
TBD
TBD
A42 SNPB
A42 SNPB
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
74LVTH16245ADGGRG4
ACTIVE
TSSOP
DGG
48
CU NIPDAU
Level-1-260C-UNLIM
74LVTH16245ADGVRE4
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
74LVTH16245ADLG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
74LVTH16245ADLRG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16245ADGGR
ACTIVE
TSSOP
DGG
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16245ADGVR
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16245ADL
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16245ADLR
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16245AGQLR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
CFP
GQL
56
TBD
SNPB
Level-1-240C-UNLIM
SN74LVTH16245AGRDR
ACTIVE
GRD
54
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVTH16245AZQLR
ACTIVE
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVTH16245AZRDR
ACTIVE
ZRD
54
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SNJ54LVTH16245AWD
ACTIVE
WD
48
1
TBD
A42 SNPB
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
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