Orderable Device
Status
(1)
Package
Type
PDIP
SOIC
Package
Drawing
P
D
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
LM2904QP
LM2904VQDR
OBSOLETE
ACTIVE
8
8
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Call TI
CU NIPDAU
Call TI
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1YEAR
2500
LM2904VQPWR
LM358AD
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
75
CU NIPDAU
CU NIPDAU
LM358ADGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
50
Pb-Free
(RoHS)
150
Pb-Free
(RoHS)
2000
Pb-Free
(RoHS)
75
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU
LM358ADR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
LM358AP
ACTIVE
PDIP
P
8
CU NIPDAU
Level-NC-NC-NC
LM358APW
ACTIVE
TSSOP
PW
8
CU NIPDAU
Level-1-250C-UNLIM
LM358APWR
ACTIVE
TSSOP
PW
8
CU NIPDAU
Level-1-250C-UNLIM
LM358D
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
LM358DGKR
ACTIVE
MSOP
DGK
8
CU NIPDAU
Level-2-260C-1YEAR
LM358DR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
LM358P
ACTIVE
PDIP
P
8
CU NIPDAU
Level-NC-NC-NC
LM358PSLE
LM358PSR
OBSOLETE
ACTIVE
SO
SO
PS
PS
8
8
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Call TI
CU NIPDAU
Call TI
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
2000
LM358PW
ACTIVE
TSSOP
PW
8
150
CU NIPDAU
LM358PWLE
LM358PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
Call TI
CU NIPDAU
Call TI
Level-1-250C-UNLIM
2000
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
Not yet available Lead (Pb-Free).
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
The information provided on this page represents TI's knowledge and belief as of the date that it is