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參數(shù)資料
| 型號： | LM2623MMX |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | General Purpose, Gated Oscillator Based, DC/DC Boost Converter |
| 中文描述： | 1.2 A SWITCHING REGULATOR, 2000 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封裝： | MINI, SO-8 |
| 文件頁數(shù)： | 5/11頁 |
| 文件大?。?/td> | 216K |
| 代理商： | LM2623MMX |
Electrical Characteristics
(Continued)
Note 8:
Junction to ambient thermal resistance (
θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set forthe in the JEDEC
standard JESD51-17. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 3 x 2 array of thermal vias. The ground plane on the board
is 50mm x 50 mm. Thickness of copper layers are 36mm/18mm/18mm/36mm (1.5oz/10z/1oz/1.5ox). Ambient temperature in simulation is 22C, still air. Power
dissipation is 1W. (The DAP is soldered.) Fore more information on LLP thermal topics, as well as LLP mounting and soldering specifications please refer to
Application Note 1187: Leadless Leadframe Package (LLP)
.
Note 9:
Exposed DAP soldered to an exposed 1sq. inch area of 1 oz. copper. Thermal resistance can be decreased by using more copper are to dissipate heat.
L
www.national.com
5
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