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參數(shù)資料
| 型號： | LM2707MFX |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 顯示驅(qū)動器 |
| 英文描述： | Inductive-Boost Series LED Driver with Programmable Oscillator Frequency |
| 中文描述： | LED DISPLAY DRIVER, PDSO8 |
| 封裝： | SOT-23, 8 PIN |
| 文件頁數(shù)： | 4/19頁 |
| 文件大?。?/td> | 1039K |
| 代理商： | LM2707MFX |
Electrical Characteristics
(Notes 2, 7) (Continued)
Unless otherwise specified: V
IN
= 3.0V, L
x
= Open, V
OVP
= Open, V
FB
= GND, C
x
= 300pF, V
EN
= V
IN
, T
A
= 25C.
Symbol
Parameter
Open Circuit Protection Section (V
OVP
pin)
V
OVP
Output Over-Voltage Protection
(Open Circuit)
Protection Deactivation Threshold
Hysteresis
I
OVP
V
OVP
Pin Input Current
V
OVP
= 18.5V, V
EN
= 3V
V
OVP
= 18.5V, V
EN
= 0V
Input Voltage Section (V
IN
pin)
V
IN, Low
Undervoltage Lockout (Low
Voltage Stop)
Lockout Activation Threshold
Hysteresis
I
IN, Off
Shutdown Supply Current
V
EN
= 0.3V
I
IN, On
Quiescent Supply Current
V
FB
= 1.0V
Condition
Min
Typ
Max
Units
Protection Activation Threshold
17.5
17.0
18.75
18.25
0.5
50
0.03
20.0
19.5
V
V
V
μA
μA
100
Lockout Deactivation Threshold
1.8
1.7
2.0
1.9
0.1
0.01
0.5
2.3
2.2
V
V
V
μA
mA
1
0.2
0.8
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
For detailed soldering specifications and information, please consult the National Semiconductor Application Note titled: "Mounting of Surface Mount
Components".
Note 4:
The Human body model is a 100pF capacitor discharged through a 1.5k
resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF
capacitor discharged directly into each pin. (EAIJ)
Note 5:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
= 125
o
C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (
θ
JA
D-MAX
).
Note 6:
Junction-to-ambient thermal resistance (
θ
JA
) is highly application and board-layout dependent. The 125
o
C/W figure provided was measured on a 4-layer
test board conforming to JEDEC standards. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues
when designing the board layout.
Note 7:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm.
Note 8:
I
LIMIT
: The value of current source I
L
(DC measurement) when the switching operation is stopped by the I
S
comparator.
Note 9:
R
SC
: Guaranteed by the design equation: I
LIMIT
= { 0.1V - [(2.3V x V
IN
) / 300] } / R
SC
Note 10:
Do not connect the output circuit directly to GND: R
SC
might be damaged. (Excessive current will pass through R
SC
, the Schottky Diode, and the coil.)
L
www.national.com
4
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