
Block Diagram
20141635
Operation Description
The LM3203 is a simple, step-down DC-DC converter with a
bypass switch, optimized for powering RF power amplifiers
(PAs) in mobile phones, portable communicators, and similar
battery powered RF devices. It is designed to allow the RF
PA to operate at maximum efficiency over a wide range of
power levels from a single Li-Ion battery cell. It is based on
current-mode buck architecture, with synchronous rectifica-
tion for high efficiency. It is designed for a maximum load
capability of 500mA. Maximum load range may vary from
this depending on input voltage, output voltage and the
inductor chosen.
The device has all three of the pin-selectable operating
modes required for powering RF PAs in mobile phones and
other sophisticated portable device with complex power
management needs. Fixed-frequency PWM operation offers
regulated output at high efficiency while minimizing interfer-
ence with sensitive IF and data acquisition circuits. Bypass
mode turns on an internal FET bypass switch to power the
PA directly from the battery. This helps the RF power ampli-
fier maintain its operating power during low battery condi-
tions by reducing the dropout voltage across the LM3203.
Shutdown mode turns the device off and reduces battery
consumption to 0.1μA (typ.).
DC PWM mode output voltage precision is +/-2% for
1.2V
OUT
. Efficiency is typically around 96% for a 150mAload
with 3.2V output, 3.6V input. PWM mode quiescent current is
0.675 mA (typ.). The FB pin voltage is dynamically program-
mable from 0.267V to 1.2V by adjusting the voltage on the
V
. External divider resistors can change the output
voltge range. This ensures longer battery life by being able
to change the PA supply voltage dynamically depending on
its transmitting power.
Additional features include current overload protection, over
voltage protection and thermal shutdown.
The LM3203 is constructed using a chip-scale 10-pin micro
SMD package. This package offers the smallest possible
size, for space-critical applications such as cell phones,
where board area is an important design consideration. Use
of a high switching frequency (2MHz typ.) reduces the size of
external components. Use of a micro SMD package requires
special design considerations for implementation. (See Mi-
cro SMD Package Assembly and use in the Applications
Information section.) Its fine bump-pitch requires careful
board design and precision assembly equipment. Use of this
package is best suited for opaque-case applications, where
its edges are not subject to high-intensity ambient red or
infrared light. Also, the system controller should set EN low
during power-up and other low supply voltage conditions.
(See Shutdown Mode in the Device Information section.)
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