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參數(shù)資料
| 型號： | LM3570 |
| 廠商： | National Semiconductor Corporation |
| 元件分類： | LED驅(qū)動器 |
| 英文描述： | Low Noise White LED Driver System |
| 中文描述： | 低噪聲白光LED驅(qū)動器系統(tǒng) |
| 文件頁數(shù)： | 4/13頁 |
| 文件大?。?/td> | 352K |
| 代理商： | LM3570 |
Electrical Characteristics
(Notes 2, 8)
(Continued)
Limits in standard typeface and typical values apply for T
= 25
o
C. Limits in
boldface
type apply over the operating junction
temperature range. Unless otherwise noted, specifications apply to the LM3570 typical Application Circuit (pg.1) with: V
IN
=
3.6V, V
EN
= 3.0V, V
PWM
= 3.0V, V
DX
=3.6V, R
SET
= 6.25k
, C
1
=C
2
=1.0μF, C
IN
=2.2μF, C
OUT
=3.3μF(Note 9)
Symbol
Parameter
Condition
V
SET
I
SET
Pin Voltage
Output Current to Current
Set Ratio
Switching Frequency
(Note 15)
t
START
Start-up Time
I
Dx
= 90% steady state
Min
Typ
1.25
Max
Units
V
I
Dx
/ I
SET
100
f
SW
3.0V
≤
V
IN
≤
5.5V
300
500
665
kHz
250
μs
EN and PWM Pin Characteristics
V
EN-IL
V
EN-IH
V
PWM-IL
V
PWM-IH
Enable Pin Logic Low
Enable Pin Logic High
PWM Pin Logic Low
PWM PinLogic High
Enable Pin Leakage Current
(Note 14)
PWM Pin Leakage Current
(Note 14)
3.0V
≤
V
IN
≤
5.5V
3.0V
≤
V
IN
≤
5.5V
3.0V
≤
V
IN
≤
5.5V
3.0V
≤
V
IN
≤
5.5V
0
0.5
V
IN
0.5
V
IN
V
V
V
V
1.0
0
1.0
I
LEAK-EN
10
μA
I
LEAK-PWM
10
μA
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
=150
o
C (typ.) and disengages at
T
J
=140
o
C (typ.).
Note 4:
For detailed soldering specifications and information, please refer to National Semiconductor
Application Note 1187: Leadless Leadframe Package
(LLP).
Note 5:
The Human body model is a 100pF capacitor discharged through a 1.5k
resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF
capacitor discharged directly into each pin. (EAIJ)
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
= 125
o
C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (
θ
JA
D-MAX
).
Note 7:
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design. For more information on these topics, please refer to
Application Note 1187: Leadless
Leadframe Package (LLP)
and the PCB Layout Considerations and Power Dissipation section of this datasheet.
Note 8:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm.
Unless otherwise specified, conditions for Typ specifications are: V
IN
= 3.6V and T
A
= 25
o
C.
Note 9:
C
IN
, C
OUT
, C1, and C2 : Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
Note 10:
Maximum I
Dx
=20mA
Note 11:
I
TOT
is equal to the sum of all I
Dx
currents and the current drawn from V
OUT
. Current can be drawn from any combination of V
OUT
and I
D1
, I
D2
, and I
D3
as long as the maximum current does not exceed 80mA.
Note 12:
For the group of the three outputs on a part the following are determined: the maximum output current in the group (MAX), the minimum output current
in the group (MIN), and the average output current of the group (AVG).Two matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest
number of the two (worst case) is considered the matching figure for the group. The matching figure for a given part is considered to be the highest matching figure.
The typical specification provided is the most likely norm of the matching figure for all parts.
Note 13:
Headroom Voltage is defined as the amount of voltage required across the regulated current sources in order to guarantee the full amount of output current
is realized. V
OUT
– V
Dx
= V
HR
. The minimum headroom required is defined as follows: V
HR
(min)
≥
k
HR
x I
Dx
where k
HR
is the headroom proportionality constant
and I
Dx
is the desired controlled diode current. The LM3570 has a k
HR
= 25mV/mA. For more information, please refer to the output current section of this datasheet.
Note 14:
The EN and PWM pins have 300k
internal pull-down resistors. When the part is in shutdown, the PWM pin must be tied low to ensure lowest possible
shutdown current.
Note 15:
The output switches operate at one eighth of the oscillator frequency, f
OSC
=8xf
SW
L
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