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參數(shù)資料
| 型號： | LM4510SDX |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Synchronous Step-Up DC/DC Converter with True Shutdown Isolation |
| 中文描述： | 1.8 A SWITCHING REGULATOR, 1200 kHz SWITCHING FREQ-MAX, DSO10 |
| 封裝： | 3 X 3 MM, 0.80 MM HEIGHT, LLP-10 |
| 文件頁數(shù)： | 5/18頁 |
| 文件大小： | 2362K |
| 代理商： | LM4510SDX |
Note 1:
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
This condition applies if V
< V
. If V
> V
, a voltage greater than V
+ 0.3V should not be applied to the VOUT or VSW pins. The absolute
maximum specification applies to DC voltage. An extended negative voltage limit of -1V applies for a pulse of up to 1 μs, and -2V for a pulse of up to 40 ns. An
extended positive voltage limit of 22V applies for a pulse of up to 20 ns.
Note 4:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
=150°C (Typ.) and disengages at
T
J
=140°C (Typ.).
Note 5:
For detailed soldering information and specifications, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (LLP) ,
available at www.national.com.
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
= 125°C), the maximum power
dissipation of the device in the application (P
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
)
Note 7:
Junction-to-ambient thermal resistance (
θ
) is taken by a numerical analysis conforming to JEDEC standards. In applications where high maximum
power dissipation exists (high V
, high I
), special care must be paid to thermal dissipation issues when designing the board layout. For more information on
these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP).
Note 8:
All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production
tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical
Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 9:
Typical numbers are at 25°C and represent the most likely norm.
Note 10:
Current flows out of the pin.
Note 11:
Current flows into the pin.
Note 12:
The Human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin (MIL-STD-883 3015.7). The machine model is a 200
pF capacitor discharged directly into each pin.
www.national.com
L
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