參數資料
型號: LM4700MWC
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 音頻/視頻放大
英文描述: 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC
封裝: WAFER
文件頁數: 6/19頁
文件大小: 558K
代理商: LM4700MWC
Application Information (Continued)
ter than the required ±0.25 dB specified. This fact results in
a low and high frequency pole of 4 Hz and 100 kHz respec-
tively. As stated in the External Components section, R
I in
conjunction with C
I create a high-pass filter.
C
I ≥ 1/(2π * 1k * 4 Hz) = 39.8 F;
use 39 F.
The high frequency pole is determined by the product of the
desired high frequency pole, f
H, and the gain, AV. With a AV
= 21 and f
H = 100 kHz, the resulting GBWP of 2.1 MHz is
less than the minimum GBWP of 5 MHz for the LM4700. This
will ensure that the high frequency response of the amplifier
will be no worse than 0.17 dB down at 20 kHz which is well
within the bandwidth requirements of the design.
www.national.com
14
相關PDF資料
PDF描述
LM4700T 30 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM11
LM4700TF/NOPB 30 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM11
LM4701MWC 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC
LM4730TA/NOPB 14 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM15
LM4731TA/NOPB 25 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM15
相關代理商/技術參數
參數描述
LM4700T 功能描述:IC AMP AUDIO PWR 30W AB TO220-11 RoHS:否 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Overture™ 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機,2-通道(立體聲) 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C,麥克風,靜音,短路保護,音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP(2.09x2.09) 封裝/外殼:25-WFBGA,WLCSP 包裝:帶卷 (TR)
LM4700T/NOPB 制造商:Texas Instruments 功能描述:
LM4700TF 制造商:Texas Instruments 功能描述:IC AMP + MUTE 30W 4700 TO-220-11
LM4700TF 制造商:Texas Instruments 功能描述:IC AMP + MUTE 30W 4700 TO-220-11
LM4700TF/NOPB 功能描述:IC AMP AUDIO PWR 30W AB TO220-11 RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Overture™ 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機,2-通道(立體聲) 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C,麥克風,靜音,短路保護,音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP(2.09x2.09) 封裝/外殼:25-WFBGA,WLCSP 包裝:帶卷 (TR)