參數(shù)資料
型號(hào)： LM4755MWC
廠商： NATIONAL SEMICONDUCTOR CORP
元件分類： 音頻／視頻放大
英文描述： 11 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC
封裝： WAFER
文件頁(yè)數(shù)： 4/19頁(yè)
文件大?。?/td> 756K
代理商： LM4755MWC
Application Information (Continued)
θ
JC = 2C/W
Junction-to-Case Thermal Resistance
Calculations:
2
P
DMAX =2 [VS
2 /2
π2 R
L)] = (24V)
2 /(2
π2 4)
= 14.6W
θ
SA ≤ [(TJ-TA)/PDMAX]- θJC–θCS = [ (150C - 55C) / 14.6W]
- 2C/W–0.2C/W = 4.3C/W
Conclusion: Choose a heatsink with
θ
SA ≤ 4.3C/W.
TO-263 HEATSINK DESIGN EXAMPLES:
Example 1: (Stereo Single-Ended Output)
Given:
T
A=30C
T
J=150C
R
L=4
V
S=12V
θ
JC=2C/W
P
DMAX from PD vs PO Graph:
P
DMAX ≈ 3.7W
Calculating P
DMAX:
P
DMAX =VCC
2/(
π2R
L) = (12V)
2/
π2(4)) = 3.65W
Calculating Heatsink Thermal Resistance:
θ
SA < TJ TA /PDMAX θJC θCS
θ
SA < 120C/3.7W 2.0C/W 0.2C/W = 30.2C/W
Therefore the recommendation is to use 1.5 x 1.5 square
inch of single-sided copper clad.
Example 2: (Stereo Single-Ended Output)
Given:
T
A=50C
T
J=150C
R
L=4
V
S=12V
θ
JC=2C/W
P
DMAX from PD vs PO Graph:
P
DMAX ≈ 3.7W
Calculating P
DMAX:
P
DMAX =VCC
2/(
π2R
L)= (12V)
2/(
π2(4)) = 3.65W
Calculating Heatsink Thermal Resistance:
θ
SA < [(TJ TA)/PDMAX] θJC θCS
θ
SA < 100C/3.7W 2.0C/W 0.2C/W = 24.8C/W
Therefore the recommendation is to use 2.0 x 2.0 square
inch of single-sided copper clad.
Example 3: (Bridged Output)
Given:
T
A=50C
T
J=150C
R
L=8
V
S=12V
θ
JC=2C/W
Calculating P
DMAX:
P
DMAX = 4[VCC
2/(2
π2R
L)] = 4(12V)
2/(2
π2(8)) = 3.65W
Calculating Heatsink Thermal Resistance:
θ
SA < [(TJ TA)/PDMAX] θJC θCS
θ
SA < 100C / 3.7W 2.0C/W 0.2C/W = 24.8C/W
Therefore the recommendation is to use 2.0 x 2.0 square
inch of single-sided copper clad.
LAYOUT AND GROUND RETURNS
Proper PC board layout is essential for good circuit perfor-
mance. When laying out a PC board for an audio power
amplifier, particular attention must be paid to the routing of
the output signal ground returns relative to the input signal
and bias capacitor grounds. To prevent any ground loops,
the ground returns for the output signals should be routed
separately and brought together at the supply ground. The
input signal grounds and the bias capacitor ground line
should also be routed separately. The 0.1 F high frequency
supply bypass capacitor should be placed as close as pos-
sible to the IC.
LM4755
www.national.com
12
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