參數(shù)資料
型號(hào)： LM4841LQ/NOPB
廠商： NATIONAL SEMICONDUCTOR CORP
元件分類： 音頻控制
英文描述： 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, QCC28
封裝： LLP-28
文件頁(yè)數(shù)： 7/31頁(yè)
文件大?。?/td> 1138K
代理商： LM4841LQ/NOPB
Application Information (Continued)
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4841’s exposed-DAP (die attach paddle) packages
(MH,LQ) provide a low thermal resistance between the die
and the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane and, finally, surrounding
air. The result is a low voltage audio power amplifier that
produces 2.1W at
≤ 1% THD with a 4 load. This high power
is achieved through careful consideration of necessary ther-
mal design. Failing to optimize thermal design may compro-
mise the LM4841’s high power performance and activate
unwanted, though necessary, thermal shutdown protection.
The MH and LQ packages must have their exposed DAPs
soldered to a grounded copper pad on the PCB. The DAP’s
PCB copper pad is connected to a large grounded plane of
continuous unbroken copper. This plane forms a thermal
mass heat sink and radiation area. Place the heat sink area
on either outside plane in the case of a two-sided PCB, or on
an inner layer of a board with more than two layers. Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 32(4x8) (MH) vias or 6(3x2) LQ. The via
diameter should be 0.012in–0.013in with a 1.27mm pitch.
Ensure efficient thermal conductivity by plating-through and
solder-filling the vias.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
2 (min) area is
necessary for 5V operation with a 4
load. Heatsink areas
not placed on the same PCB layer as the LM4841MH and
LQ packages should be 5in
2 (min) for the same supply
voltage and load resistance. The last two area recommen-
dations apply for 25C ambient temperature. Increase the
area to compensate for ambient temperatures above 25C.
The junction temperature must be held below 150C to pre-
vent activating the LM4841’s thermal shutdown protection.
The LM4841’s power de-rating curve in the Typical Perfor-
mance Characteristics shows the maximum power dissipa-
tion versus temperature. Example PCB layouts for the
exposed-DAP TSSOP and LQ packages are shown in the
Demonstration Board Layout section. Further detailed and
specific information concerning PCB layout and fabrication is
available in National Semiconductor’s AN1187.
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3
AND 4 LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load’s impedance. As load imped-
ance decreases, load dissipation becomes increasingly de-
pendent on the interconnect (PCB trace and wire) resistance
between the amplifier output pins and the load’s connec-
tions. Residual trace resistance causes a voltage drop,
which results in power dissipated in the trace and not in the
load as desired. For example, 0.1
trace resistance reduces
the output power dissipated by a 4
load from 2.1W to 2.0W.
This problem of decreased load dissipation is exacerbated
as load impedance decreases. Therefore, to maintain the
highest load dissipation and widest output voltage swing,
PCB traces that connect the output pins to a load must be as
wide as possible.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply’s output voltage
decreases with increasing load current. Reduced supply
voltage causes decreased headroom, output signal clipping,
and reduced output power. Even with tightly regulated sup-
plies, trace resistance creates the same effects as poor
supply regulation. Therefore, making the power supply
traces as wide as possible helps maintain full output voltage
swing.
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 2, the LM4841 output stage consists of
two pairs of operational amplifiers, forming a two-channel
(channel A and channel B) stereo amplifier. (Though the
following discusses channel A, it applies equally to channel
B.)
Figure 2 shows that the first amplifier’s negative (-) output
serves as the second amplifier’s input. This results in both
amplifiers producing signals identical in magnitude, but 180
out of phase. Taking advantage of this phase difference, a
load is placed between OUTA and +OUTA and driven dif-
ferentially (commonly referred to as “bridge mode”). This
results in a differential gain of
A
VD =2 * (RGFA/RGIA)
(1)
20028096
FIGURE 4. Single-ended output signal (Trace B) is devoid of transients. The SHUTDOWN pin is driven by a shutdown
signal (Trace A). The inverting output (Trace C) and the V
BYPASS output (Trace D) are applied across a 32
BTL load.
LM4841
www.national.com
15
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LM4841MH 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Stereo 2W Amplifiers with DC Volume Control, Transient Free Outputs, and Cap-less Headphone Drive
LM4841MH/NOPB 功能描述:IC AMP AUDIO PWR 2.2W AB 28TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR)
LM4841MT 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Stereo 2W Amplifiers with DC Volume Control, Transient Free Outputs, and Cap-less Headphone Drive
LM4841MT/NOPB 功能描述:IC AMP AUDIO PWR 2.2W AB 28TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR)
LM4842 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Stereo 2W Amplifiers with DC Volume Control Transient Free Outputs, and Cap-less Headphone Drive
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