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參數(shù)資料
| 型號(hào)： | LM4863MDC |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 音頻／視頻放大 |
| 英文描述： | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
| 封裝： | DIE |
| 文件頁(yè)數(shù)： | 21/22頁(yè) |
| 文件大?。?/td> | 757K |
| 代理商： | LM4863MDC |
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Typical Performance Characteristics (Continued)
External Components Description
(Refer to
Figure 1.)
Components
Functional Description
1.
R
i
The Inverting input resistance, along with R
f, set the closed-loop gain. Ri, along with Ci, form a high pass
filter with f
c = 1/(2πRiCi).
2.
C
i
The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. C
i, along with Ri, create
a highpass filter with f
c = 1/(2πRiCi). Refer to the section, SELECTING PROPER EXTERNAL
COMPONENTS, for an explanation of determining the value of C
i.
3.
R
f
The feedback resistance, along with R
i, set the closed-loop gain.
4.
C
s
The supply bypass capacitor. Refer to the POWER SUPPLY BYPASSING section for information about
properly placing, and selecting the value of, this capacitor.
5.
C
B
The capacitor, C
B, filters the half-supply voltage present on the BYPASS pin. Refer to the SELECTING
PROPER EXTERNAL COMPONENTS section for information concerning proper placement and selecting
C
B’s value.
Application Information
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4863’s exposed-DAP (die attach paddle) packages
(MTE and LQ) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surround-
ing PCB copper traces, ground plane and, finally, surround-
ing air. The result is a low voltage audio power amplifier that
produces 2.2W at
≤ 1% THD with a 4 load. This high power
is achieved through careful consideration of necessary ther-
mal design. Failing to optimize thermal design may compro-
mise the LM4863’s high power performance and activate un-
wanted, though necessary, thermal shutdown protection.
The MTE and LQ packages must have their DAPs soldered
to a copper pad on the PCB. The DAP’s PCB copper pad is
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass and heat sink and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided PCB, or on an inner layer of a board with
more than two layers. Connect the DAP copper pad to the in-
ner layer or backside copper heat sink area with 32(4x8)
(MTE) or 6(3x2) (LQ) vias. The via diameter should be
0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther-
mal conductivity by plating-through and solder-filling the
vias.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in2 (min) area is
necessary for 5V operation with a 4
load. Heatsink areas
not placed on the same PCB layer as the LM4863 should be
5in
2 (min) for the same supply voltage and load resistance.
The last two area recommendations apply for 25c ambient
temperature. Increase the area to compensate for ambient
temperatures above 25c. In systems using cooling fans, the
LM4863MTE can take advantage of forced air cooling. With
an air flow rate of 450 linear-feet per minute and a 2.5in
2 ex-
posed copper or 5.0in
2 inner layer copper plane heatsink,
the LM4863MTE can continuously drive a 3
load to full
power. The LM4863LQ achieves the same output power
level without forced air cooling. In all circumstances and con-
ditions, the junction temperature must be held below 150C
to prevent activating the LM4863’s thermal shutdown protec-
tion. The LM4863’s power de-rating curve in the Typical
Performance Characteristics shows the maximum power
dissipation versus temperature. Example PCB layouts for
the exposed-DAP TSSOP and LLP packages are shown in
the Demonstration Board Layout section. Further detailed
and specific information concerning PCB layout, fabrication,
and mounting an LLP package is available from National
Semiconductor’s package Engineering Group. When con-
tacting them, ask for ’Preliminary Application Note for the As-
sembly of the LLP Package on a Printed Circuit Board, Re-
vision A dated 7/14/00.’
Power Supply
Rejection Ratio
DS012881-21
Open Loop
Frequency Response
DS012881-22
Supply Current vs
Supply Voltage
DS012881-23
LM4863
www.national.com
8
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM4863MWC | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
| LM4863MX/NOPB | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO16 |
| LM4863MTEX/NOPB | 3.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20 |
| LM4863MTX/NOPB | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20 |
| LM4863N/NOPB | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP16 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4863MT | 制造商:Panasonic Industrial Company 功能描述:IC |
| LM4863MT | 制造商:Texas Instruments 功能描述:AMP AUDIO DUAL 2.2W 4863 TSSOP20 |
| LM4863MT/NOPB | 功能描述:IC AMP AUDIO PWR 3.2W AB 20TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 線(xiàn)性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4863MTE | 制造商:Texas Instruments 功能描述:Audio Amp Headphone/Speaker 2-CH Stereo 3.2W Class-AB 20-Pin TSSOP EP Rail 制造商:Texas Instruments 功能描述:IC, AUDIO PWR AMP CLASS AB 2.5W TSSOP-16, Amplifier Class:AB, No. of Channels:2, 制造商:Texas Instruments 功能描述:Audio Amplifier Circuit, Dual, 20 Pin, Plastic, TSSOP |
| LM4863MTE/NOPB | 功能描述:IC AMP AUDIO PWR 3.2W AB 20TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 線(xiàn)性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
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