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參數(shù)資料
| 型號： | LM4866 |
| 廠商： | National Semiconductor Corporation |
| 元件分類： | 音頻放大器 |
| 英文描述： | 2.2W Stereo Audio Amplifier |
| 中文描述： | 2.2W的立體聲音頻放大器 |
| 文件頁數(shù)： | 10/21頁 |
| 文件大?。?/td> | 644K |
| 代理商： | LM4866 |
Application Information
EXPOSED-DAP PACKAGE (LLP) PCB MOUNTING
CONSIDERATIONS
The LM4866’s exposed-DAP (die attach paddle) packages
(MTE and LQ) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surround-
ing PCB copper traces, ground plane and, finally, surround-
ing air. The result is a low voltage audio power amplifier that
produces 2.2W at
≤
1% THD with a 4
load. This high power
is achieved through careful consideration of necessary ther-
mal design. Failing to optimize thermal design may compro-
mise the LM4866’s high power performance and activate
unwanted, though necessary, thermal shutdown protection.
The MTE and LQ packages must have their DAPs soldered
to a copper pad on the PCB. The DAP’s PCB copper pad is
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass and heat sink and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided PCB, or on an inner layer of a board with
more than two layers. Connect the DAP copper pad to the
inner layer or backside copper heat sink area with 32(4x8)
(MTE) or 6(3x2) (LQ) vias. The via diameter should be
0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther-
mal conductivity by plating-through and solder-filling the
vias.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
2
(min) area is
necessary for 5V operation with a 4
load. Heatsink areas
not placed on the same PCB layer as the LM4866 should be
5in
2
(min) for the same supply voltage and load resistance.
The last two area recommendations apply for 25c ambient
temperature. Increase the area to compensate for ambient
temperatures above 25c. In systems using cooling fans, the
LM4866MTE can take advantage of forced air cooling. With
an air flow rate of 450 linear-feet per minute and a 2.5in
2
exposed copper or 5.0in
2
inner layer copper plane heatsink,
the LM4866MTE can continuously drive a 3
load to full
power. The LM4866LQ achieves the same output power
level without forced air cooling. In all circumstances and
conditions, the junction temperature must be held below
150C to prevent activating the LM4866’s thermal shutdown
protection. The LM4866’s power de-rating curve in the
Typi-
cal Performance Characteristics
shows the maximum
power dissipation versus temperature. Example PCB layouts
for the exposed-DAP TSSOP and LLP packages are shown
in the
Demonstration Board Layout
section.
Further detailed and specific information concerning PCB
layout, fabrication, and mounting an LLP package is avail-
able from National Semiconductor’s AN-1187.
PCB LAYOUT AND SUPPLY REGULATION CONSIDER-
ATIONS FOR DRIVING 3
AND 4
LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load’s impedance. As load imped-
ance decreases, load dissipation becomes increasingly de-
pendent on the interconnect (PCB trace and wire) resistance
between the amplifier output pins and the load’s connec-
tions. Residual trace resistance causes a voltage drop,
which results in power dissipated in the trace and not in the
load as desired. For example, 0.1
trace resistance reduces
the output power dissipated by a 4
load from 2.1W to 2.0W.
This problem of decreased load dissipation is exacerbated
as load impedance decreases. Therefore, to maintain the
highest load dissipation and widest output voltage swing,
PCB traces that connect the output pins to a load must be as
wide as possible.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply’s output voltage
decreases with increasing load current. Reduced supply
voltage causes decreased headroom, output signal clipping,
and reduced output power. Even with tightly regulated sup-
plies, trace resistance creates the same effects as poor
supply regulation. Therefore, making the power supply
traces as wide as possible helps maintain full output voltage
swing.
L
www.national.com
10
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM4866LQ | 2.2W Stereo Audio Amplifier |
| LM4866MT | 2.2W Stereo Audio Amplifier |
| LM4866MTE | 2.2W Stereo Audio Amplifier |
| LM4867 | Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| LM4867LQ | Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4866LQ | 制造商:Texas Instruments 功能描述:AMP AUDIO POWER 2W SMD LLP-24 |
| LM4866LQ/NOPB | 功能描述:IC AMP AUDIO PWR 3.2W STER 24LLP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機，2-通道（立體聲） 在某負(fù)載時最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風(fēng)，靜音，短路保護，音量控制 安裝類型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4866LQBD | 功能描述:BOARD EVALUATION LM4866LQ RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| LM4866MT | 制造商:Texas Instruments 功能描述:AMP AUDIO STEREO 2W SMD SSOP20 |
| LM4866MT/NOPB | 功能描述:IC AMP AUDIO PWR 3.2W AB 20TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機，2-通道（立體聲） 在某負(fù)載時最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風(fēng)，靜音，短路保護，音量控制 安裝類型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
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