
Electrical Characteristics for Bridged-Mode Operation
(Notes 3, 11) (Continued)
The following specifications apply for V
DD
= 5V unless otherwise specified. Limits apply for T
A
= 25C.
Symbol
Parameter
Conditions
LM4868
Units
(Limits)
Typical
(Note 12)
Limit
(Note 13)
THD+N
Total Harmonic Distortion+Noise
20Hz
≤
f
≤
20kHz, A
VD
= 2
LM4868MTE, R
L
= 4
, P
O
= 2W
LM4868LQ, R
L
= 4
, P
O
= 2W
LM4868, R
L
= 8
, P
O
= 1W
V
DD
= 5V, V
RIPPLE
= 200 mV
RMS
, R
L
= 8
,
C
B
= 2.2μF
f = 1 kHz, C
B
= 2.2μF
V
DD
= 5V, P
O
= 1.1W, R
L
= 8
0.3
0.3
0.3
67
%
%
%
dB
PSRR
Power Supply Rejection Ratio
X
TALK
SNR
Channel Separation
Signal To Noise Ratio
80
97
dB
dB
Electrical Characteristics for Single-Ended Operation
(Notes 3, 11)
The following specifications apply for V
DD
= 5V unless otherwise specified. Limits apply for T
A
= 25C.
Symbol
Parameter
Conditions
LM4868
Units
(Limits)
Typical
(Note 12)
5
85
180
Limit
(Note 13)
50
75
V
OS
P
O
Output Offset Voltage
Output Power
V
IN
= 0V
THD = 0.5%, f = 1kHz, R
L
= 32
THD+N = 1%, f = 1kHz, R
L
= 8
(Note
17)
THD+N = 1%, f = 1kHz, R
L
= 16
THD+N = 1%, f = 1kHz, R
L
= 32
THD+N = 10%, f = 1kHz, R
L
= 16
THD+N = 10%, f = 1kHz, R
L
= 32
THD = 0.05%, R
L
= 5k
A
V
= 1, P
O
= 75mW, 20 Hz
≤
f
≤
20kHz,
R
L
= 32
C
B
= 2.2μF, V
RIPPLE
= 200mV
RMS
,
f = 1kHz
f = 1kHz, C
B
= 2.2μF
V
DD
= 5V, P
O
= 340mW, R
L
= 8
mV (max)
mW (min)
mW
165
88
208
114
1
0.2
mW
mW
mW
mW
V
P-P
%
V
OUT
THD+N
Output Voltage Swing
Total Harmonic Distortion+Noise
PSRR
Power Supply Rejection Ratio
52
dB
X
TALK
SNR
Channel Separation
Signal To Noise Ratio
60
94
dB
dB
Note 3:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC andAC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not guaranteed for parameters where
no limit is given. The typical value however, is a good indication of device performance.
Note 4:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
,
θ
, and the ambient temperature T
. The maximum
allowable power dissipation is P
= (T
T
)/
θ
. For the LM4868, T
JMAX
= 150C. For the
JA
s for different packages, please see the Application
Information section or the Absolute Maximum Ratings section.
Note 5:
Human body model, 100pF discharged through a 1.5k
resistor.
Note 6:
Machine model, 220pF–240pF discharged through all pins.
Note 7:
The given
θ
JA
is for an LM4868 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 2in
2
area of 1oz printed circuit board copper.
Note 8:
The given
θ
JA
is for an LM4868 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 1in
2
area of 1oz printed circuit board copper.
Note 9:
The given
θ
JA
is for an LM4868 packaged in an MXA20A with the Exposed-DAP not soldered to printed circuit board copper.
Note 10:
The given
θ
JA
is for an LM4868 packaged in an LQA24A with the Exposed-DAP soldered to an exposed 2in
2
area of 1oz printed circuit board copper.
Note 11:
All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.
Note 12:
Typicals are measured at 25C and represent the parametric norm.
Note 13:
Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test, or
statistical analysis.
Note 14:
The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
Note 15:
Output power is measured at the device terminals.
Note 16:
When driving 3
or 4
loads and operating on a 5V supply, the LM4868LQ and LM4868MTE must be mounted to a circuit board that has a minimum of
2.5in
of exposed, uniterrupted copper area connected to the LLP or TSSOP package’s exposed DAP.
Note 17:
See Application Information section ’
Single-Ended Output Power Performance and Measurement Considerations
’ for more information.
L
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