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參數(shù)資料
| 型號： | LM4907LD |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.07 W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8 |
| 封裝： | LLP-8 |
| 文件頁數(shù)： | 2/17頁 |
| 文件大?。?/td> | 1063K |
| 代理商： | LM4907LD |
Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4907 has two internal opera-
tional amplifiers. The first amplifier’s gain is externally con-
figurable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of R
f to Ri while
the second amplifier’s gain is fixed by the two internal 20k
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase by 180. Consequently, the differential gain for the
IC is
A
VD= 2 *(Rf/Ri)
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configura-
tion where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same con-
ditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing ex-
cessive clipping, please refer to the Audio Power Amplifier
Design section.
A bridge configuration, such as the one used in LM4907,
also creates a second advantage over single-ended amplifi-
ers. Since the differential outputs, Vo1 and Vo2, are biased
at half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configura-
tion. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal
IC power dissipation and also possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4907 has two opera-
tional amplifiers in one package, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
The maximum power dissipation for a given application can
be derived from the power dissipation graphs or from Equa-
tion 1.
P
DMAX = 4*(VDD)
2/(2
π2R
L)
(1)
It is critical that the maximum junction temperature T
JMAX of
150C is not exceeded. T
JMAX can be determined from the
power derating curves by using P
DMAX and the PC board foil
area. By adding copper foil, the thermal resistance of the
application can be reduced from the free air value of
θ
JA,
resulting in higher P
DMAX values without thermal shutdown
protection circuitry being activated. Additional copper foil can
be added to any of the leads connected to the LM4907. It is
especially effective when connected to V
DD, GND, and the
output pins. Refer to the application information on the
LM4907 reference design board for an example of good heat
sinking. If T
JMAX
still exceeds 150C, then additional
changes must be made. These changes can include re-
duced supply voltage, higher load impedance, or reduced
ambient temperature. Internal power dissipation is a function
of output power. Refer to the Typical Performance Charac-
teristics curves for power dissipation information for differ-
ent output powers and output loading.
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4907’s exposed-DAP (die attach paddle) packages
(LD) provide a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper area heatsink, copper traces, ground plane, and
finally, surrounding air. The result is a low voltage audio
power amplifier that produces 1.07W dissipation in an 8
load at
≤ 1% THD+N. This power is achieved through careful
consideration of necessary thermal design. Failing to opti-
mize thermal design may compromise the LM4907’s perfor-
mance and activate unwanted, though necessary, thermal
shutdown protection.
The LM4907LD must have its DAP soldered to a copper pad
on the PCB. The DAP’s PCB copper pad is then, ideally,
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass, heat sink, and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided or multi-layer PCB. (The heat sink area
can also be placed on an inner layer of a multi-layer board.
The thermal resistance, however, will be higher.) Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 2 vias. The via diameter should be
0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther-
mal conductivity by plugging and tenting the vias with plating
and solder mask, respectively.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible. Typical appli-
cations employ a 5V regulator with 10 F tantalum or elec-
trolytic capacitor and a ceramic bypass capacitor which aid
in supply stability. This does not eliminate the need for
bypassing the supply nodes of the LM4907. The selection of
a bypass capacitor, especially C
B, is dependent upon PSRR
requirements, click and pop performance (as explained in
the section, Proper Selection of External Components),
system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4907 contains shutdown circuitry that is used to turn off
the amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when logic low is placed on the shutdown pin.
By switching the shutdown pin to GND, the LM4907 supply
current draw will be minimized in idle mode. Idle current is
measured with the shutdown pin connected to GND. The
trigger point for shutdown is shown as a typical value in the
Shutdown Hysteresis Voltage graphs in the Typical Perfor-
mance Characteristics section. It is best to switch between
ground and supply for maximum performance. While the
device may be disabled with shutdown voltages in between
ground and supply, the idle current may be greater than the
LM4907
www.national.com
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4907LQ | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4907LQ/NOPB | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4907LQX | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4907LQX/NOPB | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4907MM | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:1 Watt Audio Power Amplifier |
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