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參數(shù)資料
| 型號： | LM75AD |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | Digital temperature sensor and thermal watchdog |
| 封裝： | LM75AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 17, 2005,;LM75AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 17, 2005,;LM |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 137K |
| 代理商： | LM75AD |
LM75A_4
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 10 July 2007
20 of 24
NXP Semiconductors
LM75A
Digital temperature sensor and thermal watchdog
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 15
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19
and
20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 15
.
Table 19.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 20.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM75AD,112 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75AD,118 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75AD.112 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital temperature sensor and thermal watchdog |
| LM75AD/G-T | 功能描述:IC I2C TEMP SNSR/WATCHDOG 8-SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱管理 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 功能:溫度監(jiān)控系統(tǒng)（傳感器） 傳感器類型:內(nèi)部和外部 感應(yīng)溫度:-40°C ~ 125°C，外部傳感器 精確度:±2.5°C 本地（最大值），±5°C 遠(yuǎn)程（最大值） 拓?fù)?ADC，比較器，寄存器庫 輸出類型:2 線 SMBus? 輸出警報:無 輸出風(fēng)扇:無 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-8 供應(yīng)商設(shè)備封裝:SOT-23-8 包裝:Digi-Reel® 其它名稱:296-22675-6 |
| LM75AD112 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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