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參數(shù)資料
| 型號(hào)： | LM75ADP |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | Digital temperature sensor and thermal watchdog |
| 封裝： | LM75AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 17, 2005,;LM75AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 17, 2005,;LM |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 137K |
| 代理商： | LM75ADP |
LM75A_4
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 10 July 2007
20 of 24
NXP Semiconductors
LM75A
Digital temperature sensor and thermal watchdog
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 15
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19
and
20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 15
.
Table 19.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 20.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM75ADP,118 | 功能描述:板上安裝溫度傳感器 TEMP SENSOR DIGITAL RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75ADP,118 | 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, 0.125C, 3C, TSSOP-8 |
| LM75ADP,118-CUT TAPE | 制造商:NXP 功能描述:LM75A Series SMD 5.5 mA Digital Temperature Sensor w/ Thermal Watchdog TSSOP-8 |
| LM75ADP/DG,118 | 功能描述:板上安裝溫度傳感器 DIGITAL TEMP SENSOR AND THERMAL WATCHDOG RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75ADP118 | 制造商:NXP Semiconductors 功能描述:IC TEMP SENSOR 0.125 3 TSSOP-8 制造商:NXP Semiconductors 功能描述:IC TEMP SENSOR 0.125DEG 3DE |
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