參數(shù)資料
型號: LMH6572MQX
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 多路復(fù)用及模擬開關(guān)
英文描述: Triple 2:1 High Speed Video Multiplexer
中文描述: TRIPLE 2-CHANNEL, VIDEO MULTIPLEXER, PDSO16
封裝: SSOP-16
文件頁數(shù): 11/12頁
文件大?。?/td> 409K
代理商: LMH6572MQX
Other Applications
(Continued)
POWER DISSIPATION
The LMH6572 is optimized for maximum speed and perfor-
mance in the small form factor of the standard SSOP pack-
age. To achieve its high level of performance, the LMH6572
consumes 23 mA of quiescent current, which cannot be
neglected when considering the total package power dissi-
pation limit. To ensure maximum output drive and highest
performance, thermal shutdown is not provided. Therefore, it
is of utmost importance to make sure that the T
JMAX
is never
exceeded due to the overall power dissipation.
Follow these steps to determine the Maximum power dissi-
pation for the LMH6572:
1.
Calculate the quiescent (no-load) power: P
AMP
= I
CC
*
(V
S
), where V
S
= V
+
- V
.
2.
Calculate the RMS power dissipated in the output stage:
P
D
(rms) = rms ((V
- V
) * I
), where V
and
I
are the voltage across and the current through the
external load and V
S
is the total supply voltage.
3.
Calculate the total RMS power: P
T
= P
AMP
+ P
D
.
The maximum power that the LMH6572, package can dissi-
pate at a given temperature can be derived with the following
equation:
P
= (150 – T
AMB
)/
θ
, where T
= Ambient tempera-
ture (C) and
θ
= Thermal resistance, from junction to
ambient, for a given package (C/W). For the SSOP package
θ
JA
is 125C/W.
ESD PROTECTION
The LMH6572 is protected against electrostatic discharge
(ESD) on all pins. The LMH6572 will survive 2000V Human
Body model and 200V Machine model events. Under normal
operation the ESD diodes have no effect on circuit perfor-
mance. There are occasions, however, when the ESD di-
odes will be evident. If the LMH6572 is driven by a large
signal while the device is powered down the ESD diodes will
conduct. The current that flows through the ESD diodes will
either exit the chip through the supply pins or will flow
through the device, hence it is possible to power up a chip
with a large signal applied to the input pins. Shorting the
power pins to each other will prevent the chip from being
powered up through the input.
L
www.national.com
11
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