- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄5852 > LMH6643MA/NOPB (National Semiconductor)IC OP AMP R-R LP 3V 75MA 8-SOIC PDF資料下載
參數(shù)資料
| 型號： | LMH6643MA/NOPB |
| 廠商： | National Semiconductor |
| 文件頁數(shù)： | 16/33頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OP AMP R-R LP 3V 75MA 8-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | High Speed Amplifiers for Video Applications - Part 1 High Speed Amplifiers for Video Applications - Part 2 High Speed Amplifiers for Video Applications - Part 3 |
| 標(biāo)準(zhǔn)包裝： | 95 |
| 系列： | PowerWise® |
| 放大器類型： | 電壓反饋 |
| 電路數(shù)： | 2 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 135 V/µs |
| -3db帶寬： | 130MHz |
| 電流 - 輸入偏壓： | 1.6µA |
| 電壓 - 輸入偏移： | 1000µV |
| 電流 - 電源： | 2.7mA |
| 電流 - 輸出 / 通道： | 75mA |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 12.8 V，±1.35 V ~ 6.4 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 1270 (CN2011-ZH PDF) |
| 其它名稱： | *LMH6643MA *LMH6643MA/NOPB LMH6643MA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁當(dāng)前第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁
PACKAGE OPTION ADDENDUM
www.ti.com
9-Nov-2013
Addendum-Page 2
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 929665-04-23-I | CONN HEADER .100 DUAL STR 46POS |
| 35613150029 | FUSE SLOW 3.15A 440V 6.3X32MM |
| 250NHG03B | FUSE 250A 500V CLASS GL/GG |
| TMM-134-01-G-D-SM | CONN HEADER 68POS DUAL 2MM SMD |
| 35614000029 | FUSE SLOW 4A 440V 6.3X32MM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LMH6643MAX | 功能描述:運算放大器 - 運放 RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| LMH6643MAX/J7002224 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述: |
| LMH6643MAX/NOPB | 功能描述:運算放大器 - 運放 RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| LMH6643MAXEP | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Enhanced Plastic Low Power, 130MHz, 75mA Rail-to-Rail Output Amplifiers |
| LMH6643MM | 功能描述:運算放大器 - 運放 RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。