參數(shù)資料
型號(hào): LMV324DR2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 9/20頁(yè)
文件大?。?/td> 0K
描述: IC OP AMP QUAD LV R-R 14-SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 1MHz
電流 - 輸入偏壓: 1nA
電壓 - 輸入偏移: 1700µV
電流 - 電源: 410µA
電流 - 輸出 / 通道: 160mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOICN
包裝: 帶卷 (TR)
其它名稱: LMV324DR2G-ND
LMV324DR2GOSTR
LMV321, LMV358, LMV324
http://onsemi.com
17
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
E
D
BOTTOM VIEW
b
e
8X
B
A
C
C NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
(A3)
0.05 C
C SEATING
PLANE
SIDE VIEW
L
8X
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.127 REF
b
0.15
0.25
D
1.80 BSC
E
1.20 BSC
e
0.40 BSC
L
0.45
0.55
e/2
b2
0.30 REF
L1
0.00
0.03
L2
0.40 REF
DETAIL A
(L2)
(b2)
NOTE 5
L1
DETAIL A
M
0.10
M
0.05
0.22
0.32
8X
1.50
0.40 PITCH
0.66
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT*
7X
1
SOLDERMASK DEFINED
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
相關(guān)PDF資料
PDF描述
929834-03-27 CONN HEADER .100 SNGL STR 27POS
1445055-6 CONN HEADER 3MM 6POS R/A TIN
SSQ-126-01-T-D CONN RCPT .100" 52POS DUAL TIN
MMS-113-02-T-DV CONN RCPT 2MM 26POS DL VERT SMD
FLE-105-01-G-DV CONN RCPT .05" 10POS DUAL SMD
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