Electrical Characteristics
(Continued)
Unless otherwise noted, V
=950mV, V
= V
+ 1.0V, or 2.0V, whichever is higher. C
= 1 μF, I
= 1 mA, C
=0.47
μF. Typical values and limits appearing in normal type apply for T
= 27C. Limits appearing in
boldface
type apply over the
full junction temperature range for operation, 40 to +125C. (Note 13)
Symbol
Parameter
Conditions
Typ
Limit
Units
Min
Max
e
n
Output noise Voltage (Note 10)
BW = 10Hz to
100kHz,
V
OUT
= 0.8
V
OUT
= 1.5
V
OUT
= 3.3
60
125
180
155
15
μV
RMS
T
SHUTDOWN
Thermal Shutdown
Temperature
Hysteresis
C
Enable Control Characteristics
I
EN
(Note 12)
V
EN
Input
V
IL
Low Input Threshold
V
IH
High Input Threshold
Timing Characteristics
T
ON
Turn On Time (Note 10)
Maximum Input Current at
V
EN
= 0.0V
V
EN
= 6V
V
IN
= 2V to 6V
V
IN
= 2V to 6V
0.001
6
0.1
10
0.4
μA
2.5
V
V
0.95
To 95% Level
V
IN(MIN)
to 6.0V
V
OUT
= 0.8
V
OUT
= 1.5
V
OUT
= 3.3
80
105
175
150
200
250
μs
Transient
Response
Line Transient Response |
δ
V
OUT
| T
rise
= T
fall
= 30μs (Note 10)
δ
V
IN
= 600mV
T
rise
= T
fall
= 1μs (Note 10)I
OUT
= 1mA
to 150mA
C
OUT
= 1μF
8
16
mV
(pk - pk)
Load Transient Response
|
δ
V
OUT
|
55
80
mV
Note 1:
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the device is
guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 2:
All Voltages are with respect to the potential at the GND pin.
Note 3:
For further information on these packages please refer to the following application notes;AN-1112 Micro SMD Package Wafer Level Chip Scale
Package,AN-1187 Leadless Leadframe Package.
Note 4:
Internal thermal shutdown circuitry protects the device from permanent damage.
Note 5:
The human body model is 100pF discharged through a 1.5k
resistor into each pin. The machine model is a 200pF capacitor discharged directly into each
pin.
Note 6:
The maximum ambient temperature (T
A(max)
) is dependant on the maximum operating junction temperature (T
J(max-op)
= 125C), the maximum power
dissipation of the device in the application (P
D(max)
), and the junction to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A(max)
= T
J(max-op)
- (
θ
JA
x P
D(max)
).
Note 7:
Dropout voltage is voltage difference between input and output at which the output voltage drops to 100mV below its nominal value. This parameter only
for output voltages above 2.0V.
Note 8:
Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power dissipation is possible,
special care must be paid to thermal dissipation issues in board design.
Note 9:
The device maintains the regulated output voltage without the load.
Note 10:
This electrical specification is guaranteed by design.
Note 11:
Short circuit current is measured with V
OUT
pulled to 0V and V
IN
worst case = 6.0V.
Note 12:
Enable Pin has 1M
typical, resistor connected to GND.
Note 13:
All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at T
= 25C or correlated using
Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the electrical characteristics to process and
temperature variations and applying statistical process control.
Note 14:
V
IN(MIN)
= V
OUT(NOM)
+ 0.5V, or 2.0V, whichever is higher.
Output Capacitor, Recommended Specifications
Symbol
Parameter
Conditions
Typ
Limit
Units
Min
0.68
0.33
5
Max
C
OUT
Output Capacitor
Capacitance
(Note 15)
-40C to +125C
0C to +125C
1.0
0.47
μF
ESR
500
m
L
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