參數(shù)資料
型號(hào): LPC2104
廠商: NXP Semiconductors N.V.
英文描述: Single-chip 32-bit microcontrollers; 128 kB ISP/IAP Flash with 64 kB/32 kB/16 kB RAM
中文描述: 單片32位微控制器,128 kB的供應(yīng)商/聯(lián)合會(huì)64 kB/32 kB/16 KB RAM內(nèi)存閃存
文件頁(yè)數(shù): 23/32頁(yè)
文件大小: 155K
代理商: LPC2104
Philips Semiconductors
LPC2104/2105/2106
Single-chip 32-bit microcontrollers
Product data
Rev. 04 — 05 February 2004
23 of 32
9397 750 12792
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
7.
Limiting values
[1]
The following applies to the Limiting values:
a) Stresses above those listed under Limiting values may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any conditions other
than those described in
Section 8 “Static characteristics”
and
Section 9 “Dynamic characteristics”
of this specification is not implied.
b) This product includes circuitry specifically designed for the protection of its internal devices from
the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional
precautions be taken to avoid applying greater than the rated maximum.
c) Parameters are valid over operating temperature range unless otherwise specified. All voltages
are with respect to V
SS
unless otherwise noted.
Not to exceed 4.6 V.
Including voltage on outputs in 3-state mode.
Only valid when the V
DD3
supply voltage is present.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
[2]
[3]
[4]
[5]
[6]
Table 8:
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
V
DD1.8
Supply voltage, internal rail
V
DD3
Supply voltage, external rail
V
i
DC input voltage, 5 V tolerant I/O
pins
[3][4]
V
i
DC input voltage, other I/O pins
[2][3]
Limiting values
Conditions
Min
0.5
0.5
0.5
Max
+2.5
+3.6
6.0
Unit
V
V
V
0.5
V
DD3
+
0.5
100
100
125
-
V
I
I
T
stg
P
DC supply current per supply pin
[5]
DC ground current per ground pin
[5]
Storage temperature
[6]
Power dissipation (based on
package heat transfer, not device
power consumption)
-
-
40
1.5
mA
mA
°
C
W
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