參數(shù)資料
型號(hào): LPC2109FBD64
廠商: NXP Semiconductors N.V.
元件分類: 數(shù)學(xué)處理器
英文描述: Single-chip 16-32-bit microcontrollers; 64-128-256 kB ISP-IAP flash with 10-bit ADC and CAN
封裝: LPC2109FBD64/01<SOT314|<<<1<Always Pb-free,;LPC2119FBD64/01<SOT314-2 (LQFP64)|<<http://www.nxp.com/packages/SOT314-2.html<1<Always Pb-free,;LPC2129FBD64/01<SOT314-2
文件頁(yè)數(shù): 25/46頁(yè)
文件大?。?/td> 291K
代理商: LPC2109FBD64
LPC2109_2119_2129
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 14 June 2011
25 of 46
NXP Semiconductors
LPC2109/2119/2129
Single-chip 16/32-bit microcontrollers
7. Limiting values
[1]
The following applies to
Table 5
:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2]
Internal rail.
[3]
External rail.
[4]
Including voltage on outputs in 3-state mode.
[5]
Only valid when the V
DD(3V3)
supply voltage is present.
Not to exceed 4.6 V.
[6]
[7]
Per supply pin.
[8]
The peak current is limited to 25 times the corresponding maximum current.
[9]
Per ground pin.
[10] Dependent on package type.
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k
series resistor.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol
Parameter
V
DD(1V8)
supply voltage (1.8 V)
V
DD(3V3)
supply voltage (3.3 V)
V
DDA(3V3)
analog supply voltage (3.3 V)
V
IA
analog input voltage
V
I
input voltage
Limiting values
Conditions
Min
Max
+2.5
+3.6
+4.6
+5.1
+6.0
V
DD(3V3)
+ 0.5
100
100
150
+150
1.5
Unit
V
V
V
V
V
V
mA
mA
C
C
W
[2]
0.5
[3]
0.5
0.5
0.5
5 V tolerant I/O pins
other I/O pins
[4][5]
0.5
[4][6]
0.5
I
DD
I
SS
T
j
T
stg
P
tot(pack)
supply current
ground current
junction temperature
storage temperature
total power dissipation (per
package)
[7][8]
-
[8][9]
-
-
[10]
65
based on package heat
transfer, not device
power consumption
human body model; all
pins
-
V
esd
electrostatic discharge voltage
[11]
2000
+2000
V
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