參數(shù)資料
型號(hào): LPC2927FBD144
廠商: NXP SEMICONDUCTORS
元件分類: 微控制器/微處理器
英文描述: ARM9 microcontroller with CAN, LIN, and USB
中文描述: 32-BIT, FLASH, 125 MHz, RISC MICROCONTROLLER, PQFP144
封裝: 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144
文件頁數(shù): 76/95頁
文件大?。?/td> 1855K
代理商: LPC2927FBD144
LPC2926_27_29
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2010
76 of 95
NXP Semiconductors
LPC2926/2927/2929
ARM9 microcontroller with CAN, LIN, and USB
9.4 Dynamic characteristics: SPI
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
amb
= 85
°
C ambient
temperature on wafer level. Cased products are tested at T
amb
= 25
°
C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
Table 39.
V
DD(CORE)
= V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DDA(ADC3V3)
= 3.0 V to 3.6 V; V
DDA(ADC5V0)
= 3.0 V to 5.5 V;
T
vj
=
40
°
C to +85
°
C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
specified.
[1]
Symbol
Parameter
Conditions
f
SPI
SPI operating frequency
master operation
slave operation
t
su(SPI_MISO)
SPI_MISO set-up time
T
amb
= 25
°
C;
measured in
SPI Master
mode; see
Figure 27
Dynamic characteristics of SPI pins
Min
Typ
-
-
11
Max
Unit
MHz
MHz
ns
1
65024
f
clk(SPI)
1
65024
f
clk(SPI)
-
1
2
f
clk(SPI)
1
4
f
clk(SPI)
-
Fig 27. SPI data input set-up time in SSP Master mode
t
su(SPI_MISO)
SCKn
shifting edges
SDOn
SDIn
002aae695
sampling edges
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