參數(shù)資料
型號： LQH2MCN100K02
廠商： Linear Technology Corporation
英文描述： 20mA LED Driver and OLED Driver with Integrated Schottky in 3mm x 2mm DFN
中文描述： 20mA的LED驅(qū)動器和3毫米的OLED驅(qū)動器集成肖特基x 2mm DFN封裝
文件頁數(shù)： 23/24頁
文件大?。?/td> 449K
代理商： LQH2MCN100K02
LT3498
23
3498f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DDB Package
12-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1723 Rev )
2.00
±
0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40
±
0.10
BOTTOM VIEW—EXPOSED PAD
0.64
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
R = 0.05
TYP
2.39
±
0.10
(2 SIDES)
3.00
±
0.10
(2 SIDES)
1
6
12
7
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB12) DFN 0106 REV
0.23
±
0.05
0.45 BSC
PIN 1
R = 0.20 OR
0.25
×
45
°
CHAMFER
0.25
±
0.05
2.39
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64
±
0.05
(2 SIDES)
1.15
±
0.05
0.70
±
0.05
2.55
±
0.05
PACKAGE
OUTLINE
0.45 BSC
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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LQH2MCN100M52L 功能描述:固定電感器 10uH 20% 1MHz RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm
LQH2MCN120K02 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type) LQH2MC_02 Series (0806 Size)
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