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參數(shù)資料
| 型號： | LRS1320A |
| 英文描述： | SRAM/EEPROM |
| 中文描述： | 的SRAM / EEPROM的 |
| 文件頁數(shù)： | 17/43頁 |
| 文件大?。?/td> | 1326K |
| 代理商： | LRS1320A |
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LRS1382
15
Partition Configuration Register Definition
R
12
Partition Configuration
R
15
R
14
R
13
R
11
PC2
10
PC1
9
PC0
8
R
7
R
6
R
5
R
4
R
3
R
2
R
1
R
0
PCR.15-11 = RESERVED FOR FUTURE
ENHANCEMENTS (R)
PCR.10-8 = PARTITION CONFIGURATION (PC2-0)
000 = No partitioning. Dual Work is not allowed.
001 = Plane1-3 are merged into one partition.
(default in a bottom parameter device)
010 = Plane 0-1 and Plane2-3 are merged into one
partition respectively.
100 = Plane 0-2 are merged into one partition.
(default in a top parameter device)
011 = Plane 2-3 are merged into one partition. There are
three partitions in this configuration. Dual work
operation is available between any two partitions.
110 = Plane 0-1 are merged into one partition. There are
three partitions in this configuration. Dual work
operation is available between any two partitions.
101 = Plane 1-2 are merged into one partition. There are
three partitions in this configuration. Dual work
operation is available between any two partitions.
111 = There are four partitions in this configuration.
Each plane corresponds to each partition
respectively. Dual work operation is available
between any two partitions.
PCR.7-0 =
RESERVED FOR FUTURE ENHANCEMENTS (R)
Notes:
After power-up or device reset, PCR10-8 (PC2-0) is set to
“001” in a bottom parameter device and “100” in a top
parameter device.
See the table below for more details.
PCR.15-11 and PCR.7-0 are reserved for future use and should
be masked out when checking the partition configuration
register.
P
P
P
P
PARTITION1
P
P
P
P
PARTITION0
P
P
P
P
PARTITION0
P
P
P
P
PARTITION0
PARTITION1
PARTITION1
PARTITION0
P
P
P
P
PARTITION1
P
P
P
P
PARTITION0
P
P
P
P
PARTITION0
P
P
P
P
PARTITION0
PARTITION1
PARTITION1
PARTITION0
PARTITION2
PARTITION3
PARTITION2
PARTITION2
PARTITION1
PARTITION2
0
0
0
0
0
1
0
1
0
1
0
0
0
1
1
1
1
0
1
0
1
1
1
1
PC2 PC1PC0
PARTITIONING FOR DUALWORK
PARTITIONING FOR DUALWORK
PC2 PC1PC0
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LRS1329A | MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC |
| LRS1348 | Flash ROM |
| LRS1360 | Flash ROM |
| LRS1360C | MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC |
| LRS1361F | MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LRS1329 | 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:Stacked Chip 16M Flash and 2M SRAM |
| LRS1329A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC |
| LRS1331 | 制造商:Sharp Microelectronics Corporation 功能描述:COMBO 1MX16 FLASH + 256KX16 SRAM 2.7V TO 3.6V 72FBGA - Trays |
| LRS1337 | 制造商:Sharp Microelectronics Corporation 功能描述:32M (2MX16) FLASH, 4M (256KX16) SRAM, 3V, CSP72 - Trays |
| LRS1338A | 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:Stacked Chip 8M Flash Memory and 2M SRAM |
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