參數(shù)資料
型號: LSC2602
英文描述: DWDM 1.25 Gb/s DFB Laser Module with Integral Optical Isolator(帶積分光隔離器的DWDM 1.25 Gb/s DFB激光模塊)
中文描述: 密集波分復用1.25 Gb / s的光隔離器的積分DFB激光器模塊(帶積分光隔離器的DWDM技術(shù)1.25 Gb / s的激光器激光模塊)
文件頁數(shù): 2/8頁
文件大?。?/td> 135K
代理商: LSC2602
2
Wavelength Control
Wavelength tuning is achieved by
adjusting the laser chip
temperature. The laser chip
temperature is monitored using
the internal thermistor. The
Peltier effect thermoelectric
cooler deployed in the LSC26xx
is capable of maintaining a ±50°C
temperature difference. The
heating mode occurs when pin 7
is positive with respect to pin 6
and the reverse is required for
cooling to happen.
R.F. Matching
For optimum high-speed
performance the r.f. matching of
the drive current is important in
directly modulated lasers. The
LSC26xx has an internal 25 ohm
matching circuit to allow ease of
use. There are several options for
providing laser DC bias to the
LSC26xx. The most widely
deployed option is dc biasing via
pin 3 and modulating via pin 12.
Alternatively, some laser driver
ICs allow both modulation and
biasing via their output pin (to
LSC26xx pin 12) which results in
pin 3 being unused. Under such a
biasing scheme, it is
recommended that pin 3 be
decoupled to ground via a 100 nF
capacitor to prevent any RF
injection or pickup. The latter
method is generally avoided due
to the additional heat dissipation
within the laser driver IC which
impacts overall performance.
相關(guān)PDF資料
PDF描述
LSC2603 DWDM 1.25 Gb/s DFB Laser Module with Integral Optical Isolator(帶積分光隔離器的DWDM 1.25 Gb/s DFB激光模塊)
LSC2604 DWDM 1.25 Gb/s DFB Laser Module with Integral Optical Isolator(帶積分光隔離器的DWDM 1.25 Gb/s DFB激光模塊)
LSC2605 DWDM 1.25 Gb/s DFB Laser Module with Integral Optical Isolator(帶積分光隔離器的DWDM 1.25 Gb/s DFB激光模塊)
LSC2606 DWDM 1.25 Gb/s DFB Laser Module with Integral Optical Isolator(帶積分光隔離器的DWDM 1.25 Gb/s DFB激光模塊)
LSC2607 DWDM 1.25 Gb/s DFB Laser Module with Integral Optical Isolator(帶積分光隔離器的DWDM 1.25 Gb/s DFB激光模塊)
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