
4-12
Signal Descriptions
Table 4.6
describes the Miscellaneous signals.
Table 4.6
Miscellaneous Signals
Name
BGA Pos
Type Strength Description
GPIO[3:0]
C12, B12,
A12, A13
I/O
8 mA
General purpose I/O pins.
These pins default to input
mode on reset. These signals are controlled/observed
by firmware and may be configured as inputs or
outputs. GPIO[3] may be optionally enabled as an
external interrupt source to the ARM RISC Processor
core. These pads contain an internal 100
μ
A pull-up.
LED[3:0]/
D11,
C11,
B11, A11
O
8 mA
LED Outputs.
These output signals may be controlled
by firmware or driven by chip activity. When configured
as activity driven, the LED[n] outputs have the following
meaning when asserted LOW:
LED[3]: Link Fault – Word Sync not detected
LED[2]: Receive Channel Active
LED[1]: Transmit Channel Active
LED[0]: Firmware controlled
SCL
A14
O
4 mA
Serial EEPROM clock.
This pad contains an internal
100
μ
A pull-up to provide a HIGH level on this pin, if it
is not used. If used, an external pull-up is also required.
SDA
B14
I/O
4 mA
Serial EEPROM data.
This pad contains an internal
100
μ
A pull-up to provide a HIGH level on this pin, if it
is not used. If used, an external pull-up is also required.
ZCLK
A6
I
N/A
External ZBus reference clock.
When FSELZ is held
LOW, this input pin provides the reference timing for the
internal ZBus, IOP and CtxMgr processors, and
memory interface. This pad contains an internal 100
μ
A
pull-up.
WmlsoTest[2]
B2
O
4 mA
Test mode output.
Leave unconnected. This pad
contains an internal 100
μ
A pull-up.
WmlsoTest[1]
A1
O
4 mA
Test mode output.
Leave unconnected. This pad
contains an internal 100
μ
A pull-up.
WmlsoTest[0]
A2
O
4 mA
Test mode output.
Leave unconnected. This pad
contains an internal 100
μ
A pull-up.