參數(shù)資料
型號(hào): LT1001MJ8
廠商: LINEAR TECHNOLOGY CORP
元件分類: 運(yùn)動(dòng)控制電子
英文描述: Precision Operational Amplifier
中文描述: OP-AMP, 160 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, CDIP8
封裝: 0.300 INCH, HERMETIC SEALED, CERDIP-8
文件頁(yè)數(shù): 12/12頁(yè)
文件大小: 326K
代理商: LT1001MJ8
12
LT1001
LT/GP 0396 2K REV A PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1983
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
G
FAX
: (408) 434-0507
G
TELEX
: 499-3977
SCHW
W
2
500
500
4
V
V+
+
Q7
Q5
Q3
Q6
Q27
Q28
Q29
Q24
Q25
Q31
Q32
Q4
Q8
Q11
Q12
Q33
Q34
1001 SS
Q22
2k
2k
Q15
Q26
20
240
120
180
20
3k
8k
1.5k
25k
Q16
Q21
Q23
Q13
Q14
55pF
20pF
3k
30pF
Q1B
Q10
Q9
Q19
Q20
T1
Q17
Q18
Q30
Q2B
Q2A
3
1
8
40k
40k
6k
6k
6
7
OUT
Q1A
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTIO
N
U
H Package
8-Lead TO-5 Metal Can (0.200 PCD)
(LTC DWG # 05-08-1320)
T
jmax
150
°
C
θ
ja
150
°
C/W
0.016 – 0.050
0.406 – 1.270
0.010 – 0.020
(0.254 – 0.508)
×
45
°
0
°
– 8
°
TYP
0.008 – 0.010
(0.203 – 0.254)
SO8 0695
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
BSC
1
2
3
4
0.150 – 0.157**
(3.810 – 3.988)
8
7
6
5
0.189 – 0.197*
(4.801 – 5.004)
0.228 – 0.244
(5.791 – 6.197)
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
*
**
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
T
jmax
150
°
C
θ
ja
100
°
C/W
T
jmax
150
°
C
θ
ja
130
°
C/W
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
J8 Package
8-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
0.050
(MAX
0.016 – 0.021**
(0.406
0.010 – 0.045*
(0.254
SPLANE
0.040
(MAX
0.165 – 0.185
(4.191
GAUGE
REFERENCE
0.500 – 0.750
(12.700 – 19.050)
0.305
(7.747
0.335 – 0.370
(8.50DIA
0.200
(TYP
0.027 – 0.045
(0.686
0.027 – 0.034
(0.686
0.110 – 0.160
(INSULATING
STAN
LEAD DIAMETER IS UNCONTROLLED BETWEEN TH(0.406 – 0.610)
45
°
TYP
H8(TO-5) 0.200 PCD 0595
*
**
T
jmax
150
°
C
θ
ja
150
°
C/W
θ
jc
45
°
C/W
N8 0695
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325–0.015
+0.635
–0.381
8.255
(
)
1
2
3
4
8
7
6
5
0.255
±
0.015*
(6.477
±
0.381)
0.400*
(10.160)
MAX
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
0.005
(0.127)
MIN
0.100
±
0.010
(2.540
±
0.254)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130
±
0.005
(3.302
±
0.127)
0.015
(0.380)
MIN
0.018
±
0.003
(0.457
±
0.076)
0.125
(MIN
J8 0694
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS.
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
0.300 BSC
(0.762 BSC)
0.008 – 0.018
(0.203 – 0.457)
0
°
– 15
°
0.385
±
0.025
(9.779
±
0.635)
0.005
(MIN
0.405
(10.287)
MAX
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
8
7
6
5
0.025
(0.635)
RAD TYP
0.014 – 0.026
(0.360 – 0.660)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.125
MIN
0.100
±
0.010
(2.540
±
0.254)
0.045 – 0.068
(1.143
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