LT1004C-1.2, LT1004C-2.5, LT1004I-1.2, LT1004I-2.5, LT1004M-1.2
LT1004M–2.5, LT1004Y-1.2, LT1004Y-2.5
MICROPOWER INTEGRATED VOLTAGE REFERENCES
SLVS022E – JANUARY 1989 – REVISED JANUARY 1997
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LT1004Y-1.2 and LT1004Y-2.5 chip information
This chip, when properly assembled, displays characteristics similar to those of the LT1004C. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS:
15 MILS TYPICAL
BONDING PADS:
4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
TERMINAL NUMBERS APPLY
TO LP PACKAGE ONLY
ANODE
(1)
CATHODE
(2)
67
57
(1)
(2)
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Reverse current, I
R
Forward current, I
F
Operating free-air temperature range, T
A
: LT1004C
30 mA
10 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LT1004I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LT1004M
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
0
°
C to 70
°
C
–40
°
C to 85
°
C
–55
°
C to 125
°
C
–65
°
C to 150
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.