- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄5250 > LT1010CN8 (Linear Technology)IC BUFFER HI-SPEED 150MA 8-DIP PDF資料下載
參數(shù)資料
| 型號(hào)： | LT1010CN8 |
| 廠商： | Linear Technology |
| 文件頁(yè)數(shù)： | 7/20頁(yè) |
| 文件大小： | 0K |
| 描述： | IC BUFFER HI-SPEED 150MA 8-DIP |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 放大器類型： | 緩沖器 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 75 V/µs |
| 增益帶寬積： | 20MHz |
| 電流 - 輸入偏壓： | 500µA |
| 電流 - 電源： | 5mA |
| 電流 - 輸出 / 通道： | 150mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 40 V，±2.25 V ~ 20 V |
| 工作溫度： | 0°C ~ 100°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 8-PDIP |
| 包裝： | 管件 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)當(dāng)前第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)
LT1010
15
1010fe
APPLICATIONS INFORMATION
Typical thermal calculations for the miniDIP package are
detailed in the following paragraphs.
For 4.8mA supply current (typical at 50°C, 30V supply
voltage—see supply current graphs) to the LT1010 at
±15V, PD = power dissipated in the part is equal to:
(30V)(0.0048A) = 0.144W
The rise in junction is then:
(0.144W)(100°C/W—This is
θJA for the N package)
= 14.4°C.
This means that the junction temperature in 50°C ambient
air without driving any current into a load is:
14.4°C + 50°C = 64.4°C
Using the LT1010 to drive 8V DC into a 200Ω load using
±15V power supplies dissipates PD in the LT1010 where:
PD =
V+ – VOUT
(
) V
OUT
(
)
RL
=
15V – 8V
(
) 8V
( )
200
= 0.280W
ThiscausestheLT1010junctiontemperaturetoriseanother
(0.280W)(100°C/W) = 28°C.
This heats the junction to 64.4°C + 28°C = 92.4°C.
An example of 1MHz operation further shows the limita-
tions of the N (or miniDIP) package. For ±15V operation:
PD at IL = 0 at 1MHz* = (10mA)(30V) = 0.30W
This power dissipation causes the junction to heat from
50°C(ambientinthisexample)to50°C+(0.3W)(100°C/W)
= 80°C. Driving 2VRMS of 1MHz signal into a 200Ω load
causes an additional
PD =
2V
200
15 – 2
(
)=0.130W
to be dissipated, resulting in another (0.130W)(100°C/W)
= 13°C rise in junction temperature to 80°C + 13°C = 93°C.
Thermal Resistance of DFN Package
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. DFN Measured Thermal Resistance
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE
BACKSIDE
2500 sq mm 2500 sq mm 2500 sq mm
40°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm 2500 sq mm 2500 sq mm
50°C/W
100 sq mm 2500 sq mm 2500 sq mm
62°C/W
For the DFN package, the thermal resistance junction-to-
case (
θJC), measured at the Exposed Pad on the back of
the die, is 7.5°C/W.
Continuous operation at the maximum supply voltage
and maximum load current is not practical due to thermal
limitations. Transient operation at the maximum supply
is possible. The approximate thermal time constant for a
2500sq mm 3/32" FR-4 board with maximum topside and
backside area for one ounce copper is 3 seconds. This
time constant will increase as more thermal mass is added
(i.e., vias, larger board and other components).
Foranapplicationwithtransienthighpowerpeaks,average
power dissipation can be used for junction temperature
calculationsaslongasthepulseperiodissignificantlyless
than the thermal time constant of the device and board.
*See Supply Current vs Frequency graph.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 0459848182 | CONN RCPT R/A 8PWR 40SGL 2.36MM |
| 0741621508 | CONN R/A HEADER GOLD 8POS |
| AD8476ARMZ-RL | IC AMP DIFF ADC DVR 8MSOP |
| HFA1412IB | IC BUFFER QUAD 350MHZ LP 14-SOIC |
| 0702871035 | CONN HEADER BKWY DL TIN 74POS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LT1010CN8#PBF | 功能描述:IC BUFFER HI-SPEED 150MA 8-DIP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉(zhuǎn)換速率:3.5 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:5pA 電壓 - 輸入偏移:1500µV 電流 - 電源:220µA 電流 - 輸出 / 通道:60mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:剪切帶 (CT) 其它名稱:296-29363-1 |
| LT1010CN8#PBF | 制造商:Linear Technology 功能描述:Buffer IC 制造商:Linear Technology 功能描述:IC, POWER BUFFER, SINGLE, 20MHZ, DIP-8 |
| LT1010CN8PBF | 制造商:Linear Technology 功能描述:Op Amp General Purpose +/-22V/44V PDIP8 |
| LT1010CT | 功能描述:IC BUFFER HI-SPEED 150MA TO220-5 RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:電流檢測(cè) 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:- 增益帶寬積:125kHz -3db帶寬:- 電流 - 輸入偏壓:- 電壓 - 輸入偏移:100µV 電流 - 電源:1.1µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:4-WFBGA，CSPBGA 供應(yīng)商設(shè)備封裝:4-UCSP（2x2） 包裝:剪切帶 (CT) 其它名稱:MAX9634WERS+TCT |
| LT1010CT#06 | 制造商:Linear Technology 功能描述:Fast +/ 150 mA power buffer |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。