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參數(shù)資料
| 型號： | LT1013P |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | DUAL PRECISION OPERATIONAL AMPLIFIERS |
| 中文描述： | 雙高精度運算放大器 |
| 文件頁數(shù)： | 4/25頁 |
| 文件大?。?/td> | 420K |
| 代理商： | LT1013P |
LT1013, LT1013A, LT1013D, LT1013Y
DUAL PRECISION OPERATIONAL AMPLIFIERS
SLOS018B – MAY 1988 – REVISED OCTOBER 1996
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LT1013Y chip information
This chip, when properly assembled, displays characteristics similar to the LT1013. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
IN+
IN–
VCC+
(8)
(3)
(2)
(1)
79
96
+
–
2OUT
2 IN+
2IN–
(5)
(6)
(7)
(4)
VCC–
(8)
(1)
(7)
(6)
(5)
(4)
(3)
(2)
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC+
(see Note 1)
Supply voltage, V
CC–
(see Note 1)
Differential input voltage (see Note 2)
Input voltage range, V
I
(any input, see Note 1)
Duration of short-circuit current at (or below) 25
°
C (see Note 3)
Operating free-air temperature range, T
A
: LT1013C, LT1013AC, LT1013D
22 V
–22 V
±
30 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
CC–
–5 V to V
CC+
unlimited
–0
°
C to 70
°
C
–40
°
C to 105
°
C
–55
°
C to 125
°
C
–65
°
C to 150
°
C
. . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . .
LT1013I, LT1013AI, LT1013DI
LT1013M, LT1013AM, LT1013DM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds: D or P package
Case temperature for 60 seconds: FK package
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds: JG package
Storage temperature range
260
°
C
260
°
C
300
°
C
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . .
NOTES:
1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
2. Differential voltages are at IN+ with respect to IN–.
3. The output may be shorted to either supply.
相關PDF資料 |
PDF描述 |
|---|---|
| LT1013YJG | DUAL PRECISION OPERATIONAL AMPLIFIERS |
| LT1013YFK | DUAL PRECISION OPERATIONAL AMPLIFIERS |
| LT1013IN8 | Quad Precision Op Amp |
| LT1013ACN8 | Quad Precision Op Amp |
| LT1013AMH | Quad Precision Op Amp |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LT1013-W | 制造商:Texas Instruments 功能描述:DIE/WAFER - Gel-pak, waffle pack, wafer, diced wafer on film |
| LT1013Y | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL PRECISION OPERATIONAL AMPLIFIERS |
| LT1013YD | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL PRECISION OPERATIONAL AMPLIFIERS |
| LT1013YFK | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL PRECISION OPERATIONAL AMPLIFIERS |
| LT1013YJG | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL PRECISION OPERATIONAL AMPLIFIERS |
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