PACKAGE DESCRIPTION U H Package 8-Lead TO-5 Metal Can (.200 Inch PC" />
參數(shù)資料
型號: LT1037ACN8#PBF
廠商: Linear Technology
文件頁數(shù): 6/16頁
文件大小: 0K
描述: IC PREC OP-AMP HI-SPD SNGL 8-DIP
標準包裝: 50
放大器類型: 通用
電路數(shù): 1
轉(zhuǎn)換速率: 15 V/µs
增益帶寬積: 60MHz
電流 - 輸入偏壓: 10nA
電壓 - 輸入偏移: 10µV
電壓 - 電源,單路/雙路(±): ±4 V ~ 18 V
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 8-DIP(0.300",7.62mm)
供應商設備封裝: 8-PDIP
包裝: 管件
14
LT1007/LT1037
sn100737 100737fbs
PACKAGE DESCRIPTION
U
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
45
°TYP
0.050
(1.270)
MAX
0.016 – 0.021**
(0.406 – 0.533)
0.010 – 0.045*
(0.254 – 1.143)
SEATING
PLANE
0.040
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.305 – 0.335
(7.747 – 8.509)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.200
(5.080)
TYP
0.027 – 0.045
(0.686 – 1.143)
0.027 – 0.034
(0.686 – 0.864)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
H8(TO-5) 0.200 PCD 0595
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
J8 1298
0.014 – 0.026
(0.360 – 0.660)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.125
3.175
MIN
0.100
(2.54)
BSC
0.300 BSC
(0.762 BSC)
0.008 – 0.018
(0.203 – 0.457)
0
° – 15°
0.005
(0.127)
MIN
0.405
(10.287)
MAX
0.220 – 0.310
(5.588 – 7.874)
12
3
4
87
65
0.025
(0.635)
RAD TYP
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
0.045 – 0.065
(1.143 – 1.651)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
OBSOLETE PACKAGES
相關PDF資料
PDF描述
FWJ-04-02-T-S-RA HDR 4POS 3.96MM SOLDER RA THRU-
67996-432HLF CONN HEADER 32POS .100 STR TIN
328281 CONN SPADE 14-16 AWG #6 PIDG
3403.0168.11 FUSE 1.6A 125V UMT250 T-LAG SMD
52937-2 CONN SPD SPR 14-16 AWG #10 .182
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