參數(shù)資料
型號(hào): LT1055S8#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 7/16頁(yè)
文件大?。?/td> 0K
描述: IC PREC OP-AMP JFET HI-SPD 8SOIC
標(biāo)準(zhǔn)包裝: 100
放大器類型: J-FET
電路數(shù): 1
轉(zhuǎn)換速率: 12 V/µs
增益帶寬積: 4.5MHz
電流 - 輸入偏壓: 30pA
電壓 - 輸入偏移: 500µV
電流 - 電源: 2.8mA
電壓 - 電源,單路/雙路(±): ±5 V ~ 18 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 管件
15
LT1055/LT1056
10556fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTIO
U
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
0.050
(1.270)
MAX
0.016 – 0.021**
(0.406 – 0.533)
0.010 – 0.045*
(0.254 – 1.143)
SEATING
PLANE
0.040
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.305 – 0.335
(7.747 – 8.509)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.200
(5.080)
TYP
0.027 – 0.045
(0.686 – 1.143)
0.028 – 0.034
(0.711 – 0.864)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
45
°TYP
H8(TO-5) 0.200 PCD 1197
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
PIN 1
OBSOLETE PACKAGE
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130
± .005
(3.302
± 0.127)
.020
(0.508)
MIN
.018
± .003
(0.457
± 0.076)
.120
(3.048)
MIN
12
3
4
87
6
5
.255
± .015*
(6.477
± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
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